Inventor · disambiguated record
Nasser Barabi
Also filed as: BARABI NASSER · BARABI NASSER M
12 granted patents·1 pending application·799 citations·filing 1991–2011
94Inventor score
Top patents by PatentIndex Score
13 records- 0193US6559665B1Test socket for an IC deviceCERPROBE CORP·Filed 2000·Granted May 6, 2003·82 cites·13 claims
- 0293US6297654B1Test socket and method for testing an IC device in a dead bug orientationCERPROBE CORP·Filed 2000·Granted Oct 2, 2001·73 cites·24 claims
- 0392US6208155B1Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit deviceCERPROBE CORP·Filed 1998·Granted Mar 27, 2001·118 cites·16 claims
- 0492US6046597ATest socket for an IC deviceOZ TECHNOLOGIES INC·Filed 1995·Granted Apr 4, 2000·152 cites·4 claims
- 0592US5629837AButton contact for surface mounting an IC device to a circuit boardOZ TECHNOLOGIES INC·Filed 1995·Granted May 13, 1997·123 cites·17 claims
- 0690US6220870B1IC chip socket and methodCERPROBE CORP·Filed 1998·Granted Apr 24, 2001·73 cites·17 claims
- 0788US5795172AProduction printed circuit board (PCB) edge connector test connectorINTEL CORP·Filed 1996·Granted Aug 18, 1998·85 cites·13 claims
- 0875US7679920B2Cooling air distribution scheme for communication boardsSOLARFLARE COMMUNICATIONS INC·Filed 2008·Granted Mar 16, 2010·10 cites·14 claims
- 0970US6354859B1Cover assembly for an IC socketCERPROBE CORP·Filed 1999·Granted Mar 12, 2002·41 cites·2 claims
- 1067US6373268B1Test handling method and equipment for conjoined integrated circuit diceINTEL CORP·Filed 1999·Granted Apr 16, 2002·33 cites·30 claims
- 1151USD334175SProbe interface test boardOZ TECH INC·Filed 1991·Granted Mar 23, 1993·9 cites·1 claims
- 1246US8345418B2Cooling configuration for communication boardsMARVELL INT LTD·Filed 2011·Granted Jan 1, 2013·0 cites·19 claims
- 1345US2009279253A1Cooling configuration for communication boardsMUSCIANO MICHAEL JOSEPH·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →