Inventor · disambiguated record
Nasser Budraa
Also filed as: BUDRAA NASSER · BUDRAA NASSER K
11 granted patents·6 pending applications·25 citations·filing 2000–2025
83Inventor score
Files withBUDRAA NASSER9CALIFORNIA INST OF TECHN3MICROWAVE BONDING INSTR INC2BUDRAA NASSER K1NISHIMURA HIROSHI1
Top patents by PatentIndex Score
17 records- 0186US2025360725A1Passive mixer in jetting channels of a printheadBUDRAA NASSER·Filed 2025·Application pending·0 cites
- 0282US2025303742A1Active mixer in jetting channels of a printheadBUDRAA NASSER·Filed 2025·Application pending·0 cites
- 0378US2025222694A1Flow-through printheadBUDRAA NASSER·Filed 2025·Application pending·0 cites
- 0477US12391052B2Passive mixer in jetting channels of a printheadBUDRAA NASSER·Filed 2023·Granted Aug 19, 2025·0 cites·22 claims
- 0577US12358301B2Active mixer in jetting channels of a printheadBUDRAA NASSER·Filed 2023·Granted Jul 15, 2025·0 cites·22 claims
- 0676US12291032B2Flow-through printheadBUDRAA NASSER·Filed 2023·Granted May 6, 2025·0 cites·22 claims
- 0774US6905945B1Microwave bonding of MEMS componentCALIFORNIA INST OF TECHN·Filed 2000·Granted Jun 14, 2005·21 cites·10 claims
- 0868US11135846B2Nozzle geometry for printheadsBUDRAA NASSER·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 0964US10773522B1Nozzle geometry for printheadsBUDRAA NASSER·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 1062US7985657B1Systems and methods for bonding materials using microwave energyMICROWAVE BONDING INSTR INC·Filed 2007·Granted Jul 26, 2011·3 cites·8 claims
- 1155US2025289226A1Laser treatment of printhead surfacesNISHIMURA HIROSHI·Filed 2024·Application pending·0 cites
- 1251US2025289224A1Laser treatment of printhead surfacesVO GIANG·Filed 2024·Application pending·0 cites
- 1350US12109815B2Nozzle geometry for printheadsBUDRAA NASSER·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 1444US6809305B2Microwave bonding of thin film metal coated substratesCALIFORNIA INST OF TECHN·Filed 2002·Granted Oct 26, 2004·1 cites·35 claims
- 1540US2006027570A1Microwave bonding of MEMS componentCALIFORNIA INST OF TECHN·Filed 2005·Application pending·0 cites
- 1637US7968426B1Systems and methods for bonding semiconductor substrates to metal substrates using microwave energyMICROWAVE BONDING INSTR INC·Filed 2006·Granted Jun 28, 2011·0 cites·7 claims
- 1732US8714225B2Systems and methods for bonding using microwave energyBUDRAA NASSER K·Filed 2012·Granted May 6, 2014·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →