Inventor · disambiguated record
Nan-Cheng Chen
Also filed as: CHEN NAN · CHEN NAN-CHENG
32 granted patents·15 pending applications·204 citations·filing 2007–2024
96Inventor score
Top patents by PatentIndex Score
47 records- 0196US7786557B2QFN Semiconductor packageMEDIATEK INC·Filed 2009·Granted Aug 31, 2010·35 cites·14 claims
- 0294US7838975B2Flip-chip package with fan-out WLCSPMEDIATEK INC·Filed 2009·Granted Nov 23, 2010·37 cites·52 claims
- 0392US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0492US8093722B2System-in-package with fan-out WLCSPCHEN NAN-CHENG·Filed 2010·Granted Jan 10, 2012·51 cites·32 claims
- 0590US11675856B2Product features mapIBM·Filed 2021·Granted Jun 13, 2023·3 cites·20 claims
- 0690US11373957B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2020·Granted Jun 28, 2022·2 cites·12 claims
- 0789US8044496B2QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 25, 2011·9 cites·12 claims
- 0888US9165877B2Fan-out semiconductor package with copper pillar bumpsMEDIATEK INC·Filed 2013·Granted Oct 20, 2015·8 cites·13 claims
- 0988US8310051B2Package-on-package with fan-out WLCSPCHEN NAN-CHENG·Filed 2011·Granted Nov 13, 2012·16 cites·24 claims
- 1083US10680727B2Over the air wireless test system for testing microelectronic devices integrated with antennaMEDIATEK INC·Filed 2018·Granted Jun 9, 2020·2 cites·18 claims
- 1181US10991669B2Semiconductor package using flip-chip technologyMEDIATEK INC·Filed 2016·Granted Apr 27, 2021·3 cites·23 claims
- 1281US9158880B2Layout method for printed circuit boardMEDIATEK INC·Filed 2013·Granted Oct 13, 2015·6 cites·37 claims
- 1380US10784206B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 1478US11322823B2Antenna-in-package with frequency-selective surface structureMEDIATEK INC·Filed 2018·Granted May 3, 2022·2 cites·20 claims
- 1578US10515887B2Fan-out package structure having stacked carrier substrates and method for forming the sameMEDIATEK INC·Filed 2017·Granted Dec 24, 2019·3 cites·23 claims
- 1677US10103128B2Semiconductor package incorporating redistribution layer interposerMEDIATEK INC·Filed 2017·Granted Oct 16, 2018·3 cites·19 claims
- 1775US11837552B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2022·Granted Dec 5, 2023·0 cites·19 claims
- 1875US9846756B2Layout method for printed circuit boardMEDIATEK INC·Filed 2015·Granted Dec 19, 2017·2 cites·28 claims
- 1973US10128192B2Fan-out package structureMEDIATEK INC·Filed 2017·Granted Nov 13, 2018·2 cites·15 claims
- 2071US8039933B2QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 18, 2011·2 cites·12 claims
- 2170US11848481B2Antenna-in-package with frequency-selective surface structureMEDIATEK INC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 2268US9331054B2Semiconductor package assembly with decoupling capacitorMEDIATEK INC·Filed 2014·Granted May 3, 2016·2 cites·28 claims
- 2367US9674941B2Printed circuit board for mobile platformsMEDIATEK INC·Filed 2015·Granted Jun 6, 2017·1 cites·11 claims
- 2466US8525310B2Leadframe package for high-speed data rate applicationsCHEN NAN-JANG·Filed 2011·Granted Sep 3, 2013·2 cites·11 claims
- 2565US11908759B2Semiconductor deviceMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 2665US8283757B2Quad flat package with exposed common electrode barsCHEN NAN-CHENG·Filed 2010·Granted Oct 9, 2012·2 cites·21 claims
- 2764US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 2858US9131602B2Printed circuit board for mobile platformsMEDIATEK INC·Filed 2013·Granted Sep 8, 2015·0 cites·23 claims
- 2954US2024257469A1Smart reading experience in a virtual environmentIBM·Filed 2023·Application pending·0 cites
- 3054US2009236707A1Electronic devices with enhanced heat spreadingMEDIATEK INC·Filed 2009·Application pending·0 cites
- 3153US2025238242A1Command line automationIBM·Filed 2024·Application pending·0 cites
- 3253US2024242421A1Positioning camera in metaverseIBM·Filed 2023·Application pending·0 cites
- 3352US2025148705A1Locking and showing moving objects in virtual realityIBM·Filed 2023·Application pending·0 cites
- 3450US8039319B2Method for fabricating QFN semiconductor packageMEDIATEK INC·Filed 2010·Granted Oct 18, 2011·0 cites·11 claims
- 3550US2008080142A1Electronic devices with enhanced heat spreadingMEDIATEK INC·Filed 2007·Application pending·0 cites
- 3649US2018102298A1Semiconductor deviceMEDIATEK INC·Filed 2017·Application pending·0 cites
- 3745US12404770B2Right-angle turning method for small-diameter TBM exploration adit excavationPOWERCHINA NORTHWEST ENG CORP LTD·Filed 2023·Granted Sep 2, 2025·0 cites·4 claims
- 3845US8749038B2Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereofHUANG CHUNG-ER·Filed 2008·Granted Jun 10, 2014·0 cites·9 claims
- 3945US2009020859A1Quad flat package with exposed common electrode barsMEDIATEK INC·Filed 2008·Application pending·0 cites
- 4045US2016005726A1System-in-packageMEDIATEK INC·Filed 2015·Application pending·0 cites
- 4144US7561481B2Memory controllers and pad sequence control methods thereofMEDIATEK INC·Filed 2007·Granted Jul 14, 2009·0 cites·11 claims
- 4244US2010213588A1Wire bond chip packageHSIEH TUNG-HSIEN·Filed 2009·Application pending·0 cites
- 4342US2013277801A1Chip packageMEDIATEK INC·Filed 2013·Application pending·0 cites
- 4441US2019355697A1Electronic package for high-data rate communication applicationsMEDIATEK INC·Filed 2019·Application pending·0 cites
- 4537US2013133193A1Surface mount technology process for advanced quad flat no-lead package process and stencil used therewithHSU CHIH-TAI·Filed 2011·Application pending·0 cites
- 4637US2018053665A1Pre-bumped redistribution layer structure and semiconductor package incorporating such pre-bumped redistribution layer structureMEDIATEK INC·Filed 2017·Application pending·0 cites
- 4735US2011042794A1Qfn semiconductor package and circuit board structure adapted for the sameHSIEH TUNG-HSIEN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →