Inventor · disambiguated record
Nazila Dadvand
Also filed as: DADVAND NAZILA
61 granted patents·35 pending applications·77 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
96 records- 0194US8445116B2Coated articles and methodsDADVAND NAZILA·Filed 2011·Granted May 21, 2013·11 cites·31 claims
- 0293US10748999B2Multi-super lattice for switchable arraysTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·6 cites·20 claims
- 0393US10453817B1Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 22, 2019·7 cites·20 claims
- 0492US7951600B2Electrodeposition baths, systems and methodsXTALIC CORP·Filed 2008·Granted May 31, 2011·9 cites·12 claims
- 0591US11390527B2Multi-layered SP2-bonded carbon tubesTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 19, 2022·3 cites·20 claims
- 0690US8071387B1Electrodeposition baths, systems and methodsLUND ALAN C·Filed 2011·Granted Dec 6, 2011·5 cites·8 claims
- 0790US2025066526A1Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0887US9631293B2Electrodeposition baths, systems and methodsLUND ALAN C·Filed 2011·Granted Apr 25, 2017·3 cites·14 claims
- 0986US11854933B2Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·1 cites·17 claims
- 1086US9694562B2Coated articles and methodsDADVAND NAZILA·Filed 2010·Granted Jul 4, 2017·3 cites·14 claims
- 1185US8936857B2Coated articles and methodsXTALIC CORP·Filed 2013·Granted Jan 20, 2015·11 cites·51 claims
- 1284US12312703B2Neutral pH copper plating solution for undercut reductionTEXAS INSTRUMENTS INC·Filed 2024·Granted May 27, 2025·0 cites·10 claims
- 1384US12139569B2Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·16 claims
- 1483US11145598B2Lattice bump interconnectTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 12, 2021·3 cites·18 claims
- 1583US10804201B2Dissimilar material interface having latticesTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 13, 2020·3 cites·19 claims
- 1683US10544034B1Nickel lanthanide alloys for mems packaging applicationsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 28, 2020·2 cites·22 claims
- 1781US12154845B2Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2023·Granted Nov 26, 2024·0 cites·12 claims
- 1881US11094616B2Multi-pitch leadsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 17, 2021·2 cites·25 claims
- 1981US2025341014A1NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTIONTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 2080US10692830B2Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·2 cites·14 claims
- 2180US2025087563A1Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2280US2024246317A1SP2-Bonded Carbon StructuresTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2379US2024421045A1Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2478US11254775B2Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 22, 2022·0 cites·12 claims
- 2577US11370662B2Hexagonal boron nitride structuresTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 28, 2022·0 cites·5 claims
- 2677US2025236955A1Chemically anchored mold compounds in semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2776US10832993B1Packaged multichip device with stacked die having a metal die attachTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 10, 2020·2 cites·17 claims
- 2875US2022250909A1Hexagonal boron nitride structuresTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2975US2020115815A1Coated articles, electrodeposition baths, and related systemsXTALIC CORP·Filed 2019·Application pending·0 cites
- 3074US7776379B2Metallic structures incorporating bioactive materials and methods for creating the sameMEDLOGICS DEVICE CORP·Filed 2005·Granted Aug 17, 2010·1 cites·8 claims
- 3173US11984418B2Method of forming brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2022·Granted May 14, 2024·0 cites·13 claims
- 3273US10832991B1Leadless packaged device with metal die attachTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 3373US10566267B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 18, 2020·1 cites·20 claims
- 3473US2024153841A1Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3572US11587858B2Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 3672US10957637B2Quad flat no-lead package with wettable flangesTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 23, 2021·1 cites·14 claims
- 3772US2020020656A1Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 3870US10424552B2Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 24, 2019·0 cites·20 claims
- 3970US2023243770A1Gas sensor with superlattice structureTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4069US12180595B2Chemically anchored mold compounds in semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 31, 2024·0 cites·12 claims
- 4169US11848258B2Semiconductor package with nickel-silver pre-plated leadframeTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 19, 2023·0 cites·10 claims
- 4269US11694947B2Multi-pitch leadsTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 4, 2023·0 cites·17 claims
- 4369US2020165418A1Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereofSAINT GOBAIN CERAMICS·Filed 2020·Application pending·0 cites
- 4468US11935821B2Quad flat no-lead package with wettable flangesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 19, 2024·0 cites·14 claims
- 4568US11594504B2Nickel alloy for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 28, 2023·0 cites·15 claims
- 4668US2018163315A1Coated articles, electrodeposition baths, and related systemsXTALIC CORP·Filed 2017·Application pending·0 cites
- 4768US2022173062A1Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4867US12237219B2Contact with bronze material to mitigate undercutTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 4967US12074096B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 27, 2024·0 cites·12 claims
- 5067US10584231B2Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereofSAINT GOBAIN CERAMICS·Filed 2016·Granted Mar 10, 2020·0 cites·15 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Nazila Dadvand files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →