Inventor · disambiguated record
Naoki Fukutomi
Also filed as: FUKUTOMI NAOKI
17 granted patents·2 pending applications·1,190 citations·filing 1978–2025
96Inventor score
Top patents by PatentIndex Score
19 records- 0198US5976912AFabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 2, 1999·519 cites·4 claims
- 0294US7187072B2Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2003·Granted Mar 6, 2007·52 cites·9 claims
- 0394US5153987AProcess for producing printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 1989·Granted Oct 13, 1992·85 cites·12 claims
- 0491US6365432B1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 2, 2002·41 cites·4 claims
- 0591US5426850AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jun 27, 1995·79 cites·3 claims
- 0687US6746897B2Fabrication process of semiconductor package and semiconductor packageFiled 2001·Granted Jun 8, 2004·27 cites·14 claims
- 0784US6268648B1Board for mounting semiconductor element, method for manufacturing the same, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 31, 2001·83 cites·37 claims
- 0884US6133534AWiring board for electrical tests with bumps having polymeric coatingHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 2000·56 cites·2 claims
- 0982US4830691AProcess for producing high-density wiring boardHITACHI CHEMICAL CO LTD·Filed 1987·Granted May 16, 1989·52 cites·17 claims
- 1079US6492203B1Semiconductor device and method of fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 10, 2002·30 cites·8 claims
- 1174US6568073B1Process for the fabrication of wiring board for electrical testsHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 27, 2003·37 cites·5 claims
- 1272US5532105APhotolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring boardHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jul 2, 1996·39 cites·5 claims
- 1372US4219927AMethod of producing a multistylus head deviceHITACHI CHEMICAL CO LTD·Filed 1978·Granted Sep 2, 1980·15 cites·4 claims
- 1466US5664325AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 9, 1997·25 cites·4 claims
- 1565US2025360793A1Power supply systemSUZUKI MOTOR CORP·Filed 2025·Application pending·0 cites
- 1657US4791238AHigh-density wired circuit board using insulated wiresHITACHI CHEMICAL CO LTD·Filed 1987·Granted Dec 13, 1988·18 cites·20 claims
- 1756US6708398B2Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 23, 2004·7 cites·10 claims
- 1855US5504992AFabrication process of wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 9, 1996·25 cites·3 claims
- 1941US2002094606A1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →