Inventor · disambiguated record
Nan-Yuan Huang
Also filed as: HUANG NAN · HUANG NAN-YUAN
14 granted patents·6 pending applications·88 citations·filing 2003–2025
90Inventor score
Files withUNITED MICROELECTRONICS CORP15XU YUAN PACKAGING TECHNOLOGY CO LTD2INST METAL RESEARCH CAS1
Top patents by PatentIndex Score
20 records- 0196US10109531B1Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·31 cites·20 claims
- 0295US9502410B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·13 cites·8 claims
- 0394US9530868B2Fin structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 27, 2016·20 cites·19 claims
- 0493US10283415B2Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 7, 2019·8 cites·20 claims
- 0580US9653603B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·2 cites·17 claims
- 0671US12237398B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 25, 2025·0 cites·1 claims
- 0771US9583394B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 28, 2017·1 cites·10 claims
- 0871US6834481B1Double sleeve shrinkable label inserting machineFiled 2003·Granted Dec 28, 2004·13 cites·5 claims
- 0971US2025169140A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1060US11063135B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 13, 2021·0 cites·1 claims
- 1157US2025240985A1Semiconductor structure with a deep trench capacitor structures and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1256US10121881B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·13 claims
- 1351US10170624B2Non-planar transistorUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·0 cites·7 claims
- 1448US11939669B2Coating method for continuous preparation of diamond thin film with HFCVD deviceINST METAL RESEARCH CAS·Filed 2019·Granted Mar 26, 2024·0 cites·18 claims
- 1548US9627541B2Non-planar transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·0 cites·9 claims
- 1648US2005153083A1Flat bonding wrapping filmFiled 2004·Application pending·0 cites
- 1746US2014260122A1Thermal shrink packaging machineXU YUAN PACKAGING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1842US9614034B1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 1941US2020111802A1Method of preventing charge loss from a floating gateUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2040US2014116625A1Pneumatic type heat shrink film applicatorXU YUAN PACKAGING TECHNOLOGY CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →