Inventor · disambiguated record
Naofumi Izumi
Also filed as: IZUMI NAOFUMI
3 granted patents·5 pending applications·30 citations·filing 2005–2022
68Inventor score
Top patents by PatentIndex Score
8 records- 0188US8691666B2Method for producing chip with adhesive appliedSEGAWA TAKESHI·Filed 2008·Granted Apr 8, 2014·23 cites·10 claims
- 0265US8113914B2Treating method for brittle memberOHASHI HITOSHI·Filed 2008·Granted Feb 14, 2012·4 cites·21 claims
- 0356US8298873B2Method for producing circuit substrate, and circuit substrateFUKUDA TATSUO·Filed 2008·Granted Oct 30, 2012·3 cites·4 claims
- 0450US2012319305A1Process for producing a sheet of a circuit substrateARAI TAKAYUKI·Filed 2012·Application pending·0 cites
- 0548US2022351991A1Thinned wafer manufacturing method and thinned wafer manufacturing deviceLINTEC CORP·Filed 2022·Application pending·0 cites
- 0648US2022355419A1Thinned wafer manufacturing method and thinned wafer manufacturing deviceLINTEC CORP·Filed 2022·Application pending·0 cites
- 0744US2006082002A1Sheet for circuit substrates and sheet of a circuit substrate for displaysLINTEC CORP·Filed 2005·Application pending·0 cites
- 0831US2010003481A1Display substrate for embedding pixel-controlling elementsNAKABAYASHI MASAHITO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →