Inventor · disambiguated record
Naoya Kanda
Also filed as: KANDA NAOYA
34 granted patents·4 pending applications·1,278 citations·filing 1986–2011
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US5086337AConnecting structure of electronic part and electronic device using the structureHITACHI LTD·Filed 1988·Granted Feb 4, 1992·245 cites·41 claims
- 0296US6780748B2Method of fabricating a wafer level chip size package utilizing a maskless exposureHITACHI LTD·Filed 2002·Granted Aug 24, 2004·150 cites·20 claims
- 0394US4963974AElectronic device plated with gold by means of an electroless gold plating solutionHITACHI LTD·Filed 1988·Granted Oct 16, 1990·74 cites·36 claims
- 0493US6791178B2Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 14, 2004·77 cites·19 claims
- 0592US6610934B2Semiconductor module and method of making the deviceHITACHI LTD·Filed 2001·Granted Aug 26, 2003·67 cites·14 claims
- 0688US5089104AMethod and apparatus for forming a multiple-element thin film based on ion beam sputteringHITACHI LTD·Filed 1990·Granted Feb 18, 1992·73 cites·9 claims
- 0786US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 0886US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 0985US5811877ASemiconductor device structureHITACHI LTD·Filed 1997·Granted Sep 22, 1998·84 cites·26 claims
- 1083US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 1183US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 1282US8009047B2RFID tagHITACHI LTD·Filed 2008·Granted Aug 30, 2011·11 cites·6 claims
- 1381US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 1480US8035522B2RFID tagHITACHI LTD·Filed 2008·Granted Oct 11, 2011·9 cites·17 claims
- 1579US7413130B2Paper tag identified by using radiofrequency and method of manufacturing the sameHITACHI LTD·Filed 2007·Granted Aug 19, 2008·7 cites·7 claims
- 1674US7141451B2Wireless communication medium and method of manufacturing the sameHITACHI LTD·Filed 2004·Granted Nov 28, 2006·20 cites·10 claims
- 1773US7754581B2Method for manufacturing a three-dimensional semiconductor device and a wafer used thereinELPIDA MEMORY INC·Filed 2007·Granted Jul 13, 2010·5 cites·6 claims
- 1872US6589802B1Packaging structure and method of packaging electronic partsHITACHI LTD·Filed 2000·Granted Jul 8, 2003·24 cites·6 claims
- 1971US4922377AModule and a substrate for the moduleHITACHI LTD·Filed 1988·Granted May 1, 1990·39 cites·15 claims
- 2069US5476726ACircuit board with metal layer for solder bonding and electronic circuit device employing the sameHITACHI LTD·Filed 1993·Granted Dec 19, 1995·41 cites·7 claims
- 2169US5202151AElectroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·29 cites·14 claims
- 2268US7185823B2Paper tag identified by using radiofrequency and method of manufacturing the sameHITACHI LTD·Filed 2004·Granted Mar 6, 2007·10 cites·19 claims
- 2367US6153938AFlip-chip connecting method, flip-chip connected structure and electronic device using the sameHITACHI LTD·Filed 1998·Granted Nov 28, 2000·38 cites·35 claims
- 2465US7615870B2Semiconductor device, manufacturing method thereof, and connection method of circuit boardELPIDA MEMORY INC·Filed 2006·Granted Nov 10, 2009·3 cites·12 claims
- 2564US7002250B2Semiconductor moduleRENESAS TECH CORP·Filed 2001·Granted Feb 21, 2006·14 cites·28 claims
- 2662US7190072B2RFID-chip having RFID-tag or magnifying electrodeHITACHI LTD·Filed 2005·Granted Mar 13, 2007·2 cites·12 claims
- 2759US7122087B2Method of manufacturing RFIDHITACHI LTD·Filed 2004·Granted Oct 17, 2006·6 cites·19 claims
- 2859US7084498B2Semiconductor device having projected electrodes and structure for mounting the sameRENESAS TECH CORP·Filed 2002·Granted Aug 1, 2006·9 cites·36 claims
- 2957US5191624AOptical information storing apparatus and method for production of optical deflectorHITACHI LTD·Filed 1991·Granted Mar 2, 1993·22 cites·18 claims
- 3045US4817276AProcess for producing ceramic substrates for microelectronic circuitsHITACHI LTD·Filed 1986·Granted Apr 4, 1989·7 cites·4 claims
- 3145US2008185729A1Semiconductor element unit and complex thereof, semiconductor device and module thereof, assembled structure thereof and film substrate connection structureELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 3242US4913769AProcess for preparing superconductive wiring boardHITACHI LTD·Filed 1988·Granted Apr 3, 1990·9 cites·8 claims
- 3340US5178738AIon-beam sputtering apparatus and method for operating the sameHITACHI LTD·Filed 1991·Granted Jan 12, 1993·7 cites·5 claims
- 3440US2007007344A1RFID tag and manufacturing method thereofINOUE KOSUKE·Filed 2006·Application pending·0 cites
- 3540US2012024959A1Rfid inlet and rfid tag, and method for manufacturing rfid inlet and rfid tagMINAGAWA MADOKA·Filed 2011·Application pending·0 cites
- 3638US4734233ACeramic wiring substrate and process for producing the sameHITACHI LTD·Filed 1987·Granted Mar 29, 1988·9 cites·8 claims
- 3737US2006249829A1Stacked type semiconductor deviceKATAGIRI MITSUAKI·Filed 2006·Application pending·0 cites
- 3836US4935285ACeramic substrates for microelectronic circuits and process for producing sameHITACHI LTD·Filed 1988·Granted Jun 19, 1990·4 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Naoya Kanda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →