Inventor · disambiguated record
Navid Kazem
Also filed as: Kazem Navid
6 granted patents·6 pending applications·18 citations·filing 2017–2024
75Inventor score
Files withARIECA INC9UNIV CARNEGIE MELLON2CARNEGIE MELLON UNIV A PENNSYLVANIA NON-PROFIT CORPORATION1
Top patents by PatentIndex Score
12 records- 0194US10777483B1Method, apparatus, and assembly for thermally connecting layersARIECA INC·Filed 2020·Granted Sep 15, 2020·14 cites·15 claims
- 0278US11335622B2Method, apparatus, and assembly for thermally connecting layersARIECA INC·Filed 2020·Granted May 17, 2022·1 cites·16 claims
- 0375US11232883B2Polymer composite with liquid phase metal inclusionsCARNEGIE MELLON UNIV A PENNSYLVANIA NON PROFIT CORPORATION·Filed 2020·Granted Jan 25, 2022·1 cites·31 claims
- 0474US10720261B2Polymer composite with liquid phase metal inclusionsUNIV CARNEGIE MELLON·Filed 2017·Granted Jul 21, 2020·2 cites·18 claims
- 0562US2025197596A1Methods of manufacture for thermal interface materials and apparatuses used thereofARIECA INC·Filed 2024·Application pending·0 cites
- 0659US11732172B2Method of synthesizing a thermally conductive and stretchable polymer compositeUNIV CARNEGIE MELLON·Filed 2019·Granted Aug 22, 2023·0 cites·23 claims
- 0757US12027442B1Thermal interface material, an integrated circuit formed therewith, and a method of application thereofARIECA INC·Filed 2023·Granted Jul 2, 2024·0 cites·30 claims
- 0853US2025069987A1A thermal interface material, an integrated circuit assembly, and a method for thermally connecting layersARIECA INC·Filed 2023·Application pending·0 cites
- 0951US2025037294A1Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assemblyARIECA INC·Filed 2024·Application pending·0 cites
- 1048US2024243033A1Method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefromARIECA INC·Filed 2023·Application pending·0 cites
- 1147US2024203754A1Method of deposition of a thermal interface material onto a circuit assembly and an integrated circuit formed therefromARIECA INC·Filed 2023·Application pending·0 cites
- 1246US2024213115A1A method, apparatus, and assembly for thermally connecting layers with thermal interface materials comprising rigid particlesARIECA INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →