Inventor · disambiguated record
Naomi Masuda
Also filed as: MASUDA NAOMI
19 granted patents·1 pending application·129 citations·filing 1990–2013
93Inventor score
Top patents by PatentIndex Score
20 records- 0192US8598717B2Semiconductor device and method for manufacturing the sameMASUDA NAOMI·Filed 2007·Granted Dec 3, 2013·32 cites·15 claims
- 0291US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 0391US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 0482US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 0577US8637986B2Semiconductor device and method for manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jan 28, 2014·7 cites·5 claims
- 0674US8765529B2Semiconductor device and method for manufacturing the sameSPANSION LLC·Filed 2013·Granted Jul 1, 2014·3 cites·7 claims
- 0770US8796864B2Flip chip bonded semiconductor device with shelfSPANSION LLC·Filed 2013·Granted Aug 5, 2014·2 cites·14 claims
- 0868US7816788B2Structure, method and system for assessing bonding of electrodes in FCB packagingSPANSION LLC·Filed 2008·Granted Oct 19, 2010·3 cites·20 claims
- 0966US8486756B2Flip chip bonded semiconductor device with shelf and method of manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jul 16, 2013·3 cites·18 claims
- 1062US9437573B2Semiconductor device and method for manufacturing thereofCYPRESS SEMICONDUCTOR CORP·Filed 2013·Granted Sep 6, 2016·1 cites·4 claims
- 1162US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 1262US8274158B2Structure, method and system for assessing bonding of electrodes in FCB packagingKASAI JUNICHI·Filed 2010·Granted Sep 25, 2012·2 cites·19 claims
- 1359US7892892B2Semiconductor device and method for manufacturing thereofSPANSION LLC·Filed 2008·Granted Feb 22, 2011·1 cites·8 claims
- 1457US5053464APolyurethane containing metal phthalocyanine in the main chainHIROFUSA SHIRAI & NISSHINBO IN·Filed 1990·Granted Oct 1, 1991·13 cites·20 claims
- 1549US7846780B2Flip-chip package covered with tapeSPANSION LLC·Filed 2008·Granted Dec 7, 2010·0 cites·14 claims
- 1648US2009160310A1Discharge lamp and lighting systemMOTOYA ATSUSHI·Filed 2007·Application pending·0 cites
- 1746US9385014B2Flip-chip package covered with tapeMASUDA NAOMI·Filed 2010·Granted Jul 5, 2016·0 cites·5 claims
- 1846US8446015B2Semiconductor device and method for manufacturing thereofMASUDA NAOMI·Filed 2011·Granted May 21, 2013·0 cites·11 claims
- 1941US9362173B2Method for chip packageSHI LEI·Filed 2011·Granted Jun 7, 2016·0 cites·17 claims
- 2041US8883627B2Method for chip packagingSHI LEI·Filed 2011·Granted Nov 11, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →