Inventor · disambiguated record
Naoharu Nakaiso
Also filed as: NAKAISO NAOHARU
14 granted patents·41 citations·filing 2004–2020
88Inventor score
Technology areasH10P
Top patents by PatentIndex Score
14 records- 0187US9412587B2Method of manufacturing semiconductor device, substrate processing apparatus, gas supply system, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 9, 2016·4 cites·19 claims
- 0286US7883581B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Feb 8, 2011·11 cites·11 claims
- 0381US9691609B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 27, 2017·2 cites·20 claims
- 0479US10529560B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 0576US7622007B2Substrate processing apparatus and semiconductor device producing methodHITACHI INT ELECTRIC INC·Filed 2004·Granted Nov 24, 2009·18 cites·6 claims
- 0675US9941119B2Method of forming silicon layer in manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 10, 2018·1 cites·18 claims
- 0770US9997354B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 12, 2018·1 cites·14 claims
- 0856US9540728B2Substrate processing apparatus, apparatus for manufacturing semiconductor device, and gas supply systemHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 10, 2017·0 cites·20 claims
- 0956US8673076B2Substrate processing apparatus and semiconductor device producing methodNAKAISO NAOHARU·Filed 2009·Granted Mar 18, 2014·1 cites·14 claims
- 1047US11581200B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 14, 2023·0 cites·17 claims
- 1147US11043392B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 1246US10199219B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 5, 2019·0 cites·13 claims
- 1344US10262872B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 16, 2019·0 cites·17 claims
- 1444US9437426B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 6, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →