Inventor · disambiguated record
Naofumi Nakamura
Also filed as: NAKAMURA NAOFUMI
56 granted patents·15 pending applications·552 citations·filing 1990–2020
98Inventor score
Top patents by PatentIndex Score
71 records- 0198US7786589B2Semiconductor device and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 31, 2010·93 cites·17 claims
- 0297US7989880B2Nonvolatile semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2009·Granted Aug 2, 2011·46 cites·13 claims
- 0394US9018696B2Nonvolatile semiconductor memory device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Granted Apr 28, 2015·15 cites·14 claims
- 0492US7351656B2Semiconductor device having oxidized metal film and manufacture method of the sameKABUSHIKI KAIHSA TOSHIBA·Filed 2006·Granted Apr 1, 2008·20 cites·19 claims
- 0590US6352931B1Manufacturing method of semiconductor devices by using dry etching technologyTOSHIBA KK·Filed 2000·Granted Mar 5, 2002·42 cites·12 claims
- 0688US7459391B2Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2005·Granted Dec 2, 2008·12 cites·6 claims
- 0787US7339256B2Semiconductor deviceTOSHIBA KK·Filed 2004·Granted Mar 4, 2008·47 cites·30 claims
- 0885US6291891B1Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Sep 18, 2001·69 cites·26 claims
- 0984US7994054B2Semiconductor device having oxidized metal film and manufacture method of the sameTOSHIBA KK·Filed 2007·Granted Aug 9, 2011·6 cites·20 claims
- 1083US6960834B2Semiconductor device having multi-layer interconnection structure and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Nov 1, 2005·34 cites·23 claims
- 1182US6849923B2Semiconductor device and manufacturing method of the sameTOSHIBA KK·Filed 2002·Granted Feb 1, 2005·28 cites·23 claims
- 1281US11123785B2Surface-treated steel sheet part having cut end surface, and cutting method thereforNIPPON STEEL CORP·Filed 2019·Granted Sep 21, 2021·1 cites·4 claims
- 1380US8015851B2Dowel forming method for buckle base memberNISSHIN STEEL CO LTD·Filed 2006·Granted Sep 13, 2011·8 cites·2 claims
- 1480US7791202B2Semiconductor device having oxidized metal film and manufacture method of the sameTOSHIBA KK·Filed 2008·Granted Sep 7, 2010·4 cites·20 claims
- 1579US8759162B2Nonvolatile semiconductor memory device and method of manufacturing the sameWADA MAKOTO·Filed 2011·Granted Jun 24, 2014·4 cites·7 claims
- 1679US8148274B2Semiconductor device having oxidized metal film and manufacture method of the sameWADA JUNICHI·Filed 2008·Granted Apr 3, 2012·4 cites·12 claims
- 1779US6462395B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·27 cites·8 claims
- 1878US10500626B2Molded material production method and molded materialNISSHIN STEEL CO LTD·Filed 2017·Granted Dec 10, 2019·1 cites·8 claims
- 1974US6605542B2Manufacturing method of semiconductor devices by using dry etching technologyTOSHIBA KK·Filed 2001·Granted Aug 12, 2003·13 cites·21 claims
- 2073US9274017B2MEMS deviceTOSHIBA KK·Filed 2014·Granted Mar 1, 2016·4 cites·20 claims
- 2172US10799931B2Formed material manufacturing method and surface treated metal plate used in sameNISSHIN STEEL CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·1 claims
- 2272US7902068B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 8, 2011·5 cites·21 claims
- 2372US6368951B2Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 9, 2002·16 cites·4 claims
- 2470US9901970B2Formed material manufacturing methodNISSHIN STEEL CO LTD·Filed 2014·Granted Feb 27, 2018·2 cites·3 claims
- 2566US7091618B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Aug 15, 2006·13 cites·27 claims
- 2666US2021096099A1Analysis chipAIPORE INC·Filed 2020·Application pending·0 cites
- 2764US7691740B2Semiconductor device and method of fabricating sameTOSHIBA KK·Filed 2008·Granted Apr 6, 2010·1 cites·18 claims
- 2862US5164021AMethod for manufacturing a shadow mask of a Fe-Ni alloyYAMAHA CORP·Filed 1990·Granted Nov 17, 1992·12 cites·4 claims
- 2959US7169697B2Semiconductor device and manufacturing method of the sameTOSHIBA KK·Filed 2004·Granted Jan 30, 2007·7 cites·4 claims
- 3057US10421113B2Formed material manufacturing method and surface treated metal plate used in sameNISSHIN STEEL CO LTD·Filed 2014·Granted Sep 24, 2019·0 cites·3 claims
- 3157US2018088081A1Analysis chipTOSHIBA KK·Filed 2017·Application pending·0 cites
- 3256US9821355B2Method of manufacturing rectangular tube having stepped portionNISSHIN STEEL CO LTD·Filed 2014·Granted Nov 21, 2017·0 cites·4 claims
- 3355US10908035B2Pressure sensorTOSHIBA KK·Filed 2019·Granted Feb 2, 2021·0 cites·10 claims
- 3455US9757789B2Method of manufacturing rectangular tube having stepped portionNISSHIN STEEL CO LTD·Filed 2014·Granted Sep 12, 2017·0 cites·5 claims
- 3554US9793055B2Electronic device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Granted Oct 17, 2017·0 cites·15 claims
- 3653US11214481B2MEMS elementTOSHIBA KK·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 3753US11205544B2SensorTOSHIBA KK·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 3853US2012152168A1Semiconductor device having oxidized metal film and manufacture method of the sameSAKATA ATSUKO·Filed 2012·Application pending·0 cites
- 3950US9914637B2Electronic device using MEMS technologyTOSHIBA KK·Filed 2016·Granted Mar 13, 2018·0 cites·16 claims
- 4050US2015076626A1Electronic deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4149US11169035B2Pressure sensorTOSHIBA KK·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 4249US10894283B2Molded material production method and molded materialNISSHIN STEEL CO LTD·Filed 2017·Granted Jan 19, 2021·0 cites·3 claims
- 4349US9669440B2Formed material manufacturing method and formed materialNISSHIN STEEL CO LTD·Filed 2014·Granted Jun 6, 2017·0 cites·6 claims
- 4448US10786843B2Method of manufacturing molded material, and said molded materialNISSHIN STEEL CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·4 claims
- 4548US10337976B2Microanalysis chipTOSHIBA KK·Filed 2015·Granted Jul 2, 2019·0 cites·6 claims
- 4648US10281429B2Semiconductor micro-analysis chip and method of manufacturing the sameTOSHIBA KK·Filed 2017·Granted May 7, 2019·0 cites·15 claims
- 4747US9776854B2Device and method of manufacturing the sameTOSHIBA KK·Filed 2016·Granted Oct 3, 2017·0 cites·19 claims
- 4847US9744580B2Ironing mold and formed material manufacturing methodNISSHIN STEEL CO LTD·Filed 2014·Granted Aug 29, 2017·0 cites·6 claims
- 4946US11460482B2Sensor with fixed and movble componentsTOSHIBA KK·Filed 2020·Granted Oct 4, 2022·0 cites·13 claims
- 5046US10533934B2Particle inspection system and driving method employed thereinTOSHIBA KK·Filed 2017·Granted Jan 14, 2020·0 cites·18 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →