Inventor · disambiguated record
Naofumi Ohashi
Also filed as: OHASHI NAOFUMI
99 granted patents·49 pending applications·924 citations·filing 1998–2025
99Inventor score
Files withKOKUSAI ELECTRIC CORP81HITACHI INT ELECTRIC INC32RENESAS TECH CORP12HITACHI LTD11SANYO ELECTRIC CO2
Top patents by PatentIndex Score
148 records- 0198US6184143B1Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 1998·Granted Feb 6, 2001·342 cites·25 claims
- 0297US11538661B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 27, 2022·3 cites·19 claims
- 0397US11322370B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 3, 2022·3 cites·20 claims
- 0497US11145505B1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 12, 2021·5 cites·23 claims
- 0596US11728183B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·2 cites·20 claims
- 0696US11473196B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 18, 2022·4 cites·20 claims
- 0796US10424520B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 24, 2019·15 cites·9 claims
- 0894US7538038B2Method of removing resist, semiconductor device thereby and method of manufacturing a semiconductor deviceSONY CORP·Filed 2005·Granted May 26, 2009·32 cites·18 claims
- 0993US9431220B1Substrate processing apparatus and substrate processing systemHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 30, 2016·10 cites·15 claims
- 1091US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 1191US6908847B2Method of manufacturing a semiconductor device having an interconnect embedded in an insulating filmRENESAS TECH CORP·Filed 2002·Granted Jun 21, 2005·46 cites·17 claims
- 1290US11841343B2Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 12, 2023·1 cites·18 claims
- 1390US9018689B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 28, 2015·10 cites·6 claims
- 1490US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 1589US10934622B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 2, 2021·5 cites·9 claims
- 1689US2025054794A1Processing method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1787US12424409B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1887US12091751B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 17, 2024·1 cites·12 claims
- 1986US9484249B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 1, 2016·4 cites·20 claims
- 2086US6509273B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 21, 2003·36 cites·45 claims
- 2186US2025343060A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2285US12387949B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 2385US12165894B2Processing method, method of manufacturing semiconductor, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 2485US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 2584US10685832B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 16, 2020·3 cites·8 claims
- 2684US10453720B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·3 cites·18 claims
- 2784US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 2883US6730590B2Semiconductor integrated circuit device and fabrication process thereofRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·23 cites·32 claims
- 2982US12320778B2Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jun 3, 2025·0 cites·16 claims
- 3082US12224185B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 3182US11923173B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 3282US11600488B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Mar 7, 2023·1 cites·17 claims
- 3382US9698050B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 4, 2017·3 cites·20 claims
- 3482US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 3582US6403459B1Fabrication process of semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Jun 11, 2002·22 cites·36 claims
- 3681US11043377B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 22, 2021·1 cites·6 claims
- 3781US6716749B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·14 cites·6 claims
- 3881US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 3981US6561875B1Apparatus and method for producing substrate with electrical wire thereonHITACHI LTD·Filed 2000·Granted May 13, 2003·20 cites·26 claims
- 4080US12093021B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 17, 2024·0 cites·17 claims
- 4180US10651068B1Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 12, 2020·1 cites·12 claims
- 4280US7053487B2Semiconductor deviceRENESASTECHNOLOGY CORP·Filed 2002·Granted May 30, 2006·24 cites·37 claims
- 4380US2025271401A1Substrate processing apparatus, processing method, method of manufacturing semiconductor processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4480US2025022703A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 4579US11749550B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 4679US2025340983A1Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4778US12131902B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 29, 2024·0 cites·19 claims
- 4878US9966261B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted May 8, 2018·2 cites·12 claims
- 4978US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 5077US6864169B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·12 cites·14 claims
Showing the top 50 of 148 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →