Inventor · disambiguated record
Narumi Ohkawa
Also filed as: EMA TAIJI · OHKAWA NARUMI
37 granted patents·5 pending applications·590 citations·filing 1998–2023
98Inventor score
Files withFUJITSU LTD21OHKAWA NARUMI7FUJITSU SEMICONDUCTOR LTD6FUJITSU MICROELECTRONICS LTD5UNITED SEMICONDUCTOR JAPAN CO LTD3
Top patents by PatentIndex Score
42 records- 0197US6987041B2Semiconductor device having both memory and logic circuit and its manufactureFUJITSU LTD·Filed 2001·Granted Jan 17, 2006·124 cites·4 claims
- 0296US7417273B2Image sensor with embedded photodiode region and fabrication method thereofFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·41 cites·26 claims
- 0394US7846758B2Semiconductor imaging device and fabrication process thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Dec 7, 2010·17 cites·2 claims
- 0493US7745860B2Image sensor with embedded photodiode region and manufacturing method for sameFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Jun 29, 2010·23 cites·14 claims
- 0587US10050719B1Communication method using the entangled stateOHKAWA NARUMI·Filed 2017·Granted Aug 14, 2018·6 cites·1 claims
- 0687US7767952B2Semiconductor imaging device having a plurality of pixels arranged in a matrix-like patternFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Aug 3, 2010·8 cites·6 claims
- 0787US7557846B2Solid-state image sensor including common transistors between pixelsFUJITSU MICROELECTRONICS LTD·Filed 2004·Granted Jul 7, 2009·32 cites·56 claims
- 0886US7391453B2Solid-state image sensor and image reading methodFUJITSU LTD·Filed 2003·Granted Jun 24, 2008·29 cites·7 claims
- 0986US6930299B2Semiconductor device for reading signal from photodiode via transistorsFUJITSU LTD·Filed 2003·Granted Aug 16, 2005·40 cites·26 claims
- 1085US7592655B2MOS image sensorFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Sep 22, 2009·17 cites·15 claims
- 1182US8008106B2Semiconductor imaging device and fabrication process thereofFUJITSU SEMICONDUCTOR LTD·Filed 2010·Granted Aug 30, 2011·2 cites·1 claims
- 1282US7619269B2Semiconductor device, manufacturing process thereof and imaging deviceFUJITSU MICROELECTRONICS LTD·Filed 2003·Granted Nov 17, 2009·29 cites·18 claims
- 1381US7419864B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Sep 2, 2008·8 cites·12 claims
- 1479US7361552B2Semiconductor integrated circuit including a DRAM and an analog circuitFUJITSU LTD·Filed 2006·Granted Apr 22, 2008·6 cites·2 claims
- 1579US7119387B2Solid-state image sensor and method for fabricating the sameFUJITSU LTD·Filed 2004·Granted Oct 10, 2006·24 cites·20 claims
- 1679US6894268B2Semiconductor photodetector of high sensitivity and small leak currentFUJITSU LTD·Filed 2003·Granted May 17, 2005·24 cites·15 claims
- 1779US6091154ASemiconductor device with self-aligned contact and manufacturing method thereofFUJITSU LTD·Filed 1998·Granted Jul 18, 2000·56 cites·14 claims
- 1878US7683452B2Threshold voltage modulation image sensorFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 23, 2010·5 cites·11 claims
- 1976US7560678B2Semiconductor imaging device having a plurality of pixels arranged in a matrix-like patternFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Jul 14, 2009·3 cites·6 claims
- 2074US8604557B2Semiconductor memory device and method for manufacturingOHKAWA NARUMI·Filed 2008·Granted Dec 10, 2013·6 cites·10 claims
- 2174US7429507B2Semiconductor device having both memory and logic circuit and its manufactureFUJITSU LTD·Filed 2005·Granted Sep 30, 2008·3 cites·2 claims
- 2274US7242043B2Imaging device and manufacturing method thereofFUJITSU LTD·Filed 2004·Granted Jul 10, 2007·15 cites·7 claims
- 2371US8774641B2Communication method using the entangled stateOHKAWA NARUMI·Filed 2012·Granted Jul 8, 2014·3 cites·1 claims
- 2471US7285838B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2005·Granted Oct 23, 2007·4 cites·10 claims
- 2570US12495608B2Semiconductor device and method of manufacturing semiconductor deviceUNITED SEMICONDUCTOR JAPAN CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2668US2023215913A1Manufacturing method of semiconductor deviceUNITED SEMICONDUCTOR JAPAN CO LTD·Filed 2023·Application pending·0 cites
- 2764US7732846B2Semiconductor device including solid state image pickup device, and portable electronic apparatusFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Jun 8, 2010·1 cites·16 claims
- 2862US7492047B2Semiconductor device and its manufacture methodFUJITSU LTD·Filed 2005·Granted Feb 17, 2009·2 cites·16 claims
- 2961US11670675B2Semiconductor deviceUNITED SEMICONDUCTOR JAPAN CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·17 claims
- 3061US7118957B2Semiconductor integrated circuit including a DRAM and an analog circuitFUJITSU LTD·Filed 2003·Granted Oct 10, 2006·7 cites·3 claims
- 3161US6326657B1Semiconductor device having both memory and logic circuit and its manufactureFUJITSU LTD·Filed 1999·Granted Dec 4, 2001·19 cites·8 claims
- 3259US6583458B1Semiconductor integrated circuit including a DRAM and an analog circuitFUJITSU LTD·Filed 1999·Granted Jun 24, 2003·14 cites·32 claims
- 3356US2007252184A1Imaging device and manufacturing method thereofFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3455US2007023800A1Semiconductor imaging device and fabrication process thereofFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3554US7405757B2Image sensor and image sensor moduleFUJITSU LTD·Filed 2004·Granted Jul 29, 2008·4 cites·2 claims
- 3652US7372491B2CMOS image sensorFUJITSU LTD·Filed 2004·Granted May 13, 2008·3 cites·13 claims
- 3749US6414375B1Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture methodFUJITSU LTD·Filed 1999·Granted Jul 2, 2002·15 cites·15 claims
- 3848US11349575B1Communication method using the entangled stateOHKAWA NARUMI·Filed 2020·Granted May 31, 2022·0 cites·1 claims
- 3948US2012309164A1Method for manufacturing semiconductor deviceOHKAWA NARUMI·Filed 2012·Application pending·0 cites
- 4047US8610177B2CMOS imaging device having U-shaped device isolation regionsOHKAWA NARUMI·Filed 2007·Granted Dec 17, 2013·0 cites·12 claims
- 4146US2011042785A1Semiconductor device and method for manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2010·Application pending·0 cites
- 4243US8737841B2Communication method using the entangled stateOHKAWA NARUMI·Filed 2012·Granted May 27, 2014·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Narumi Ohkawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →