US2007252184A1PendingUtilityA1
Imaging device and manufacturing method thereof
Est. expirySep 26, 2023(expired)· nominal 20-yr term from priority
Inventors:Narumi Ohkawa
H10F 39/804H10F 39/803H10F 39/802H10F 39/80H10F 39/026H10F 39/014H10F 39/811
56
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Claims
Abstract
Disclosed is an imaging device including a photodiode and floating diffusion region formed to be spaced from each other on a surface layer of a pixel region of a silicon (semiconductor) substrate, and a transfer gate having one of a concave and convex portions toward the floating diffusion region, the transfer gate being formed above the silicon substrate between the photodiode and the floating diffusion region by interposing a gate insulating film therebetween.
Claims
exact text as granted — not AI-modified1 . An imaging device, comprising:
a photodiode and a floating diffusion region formed to be spaced from each other on a surface layer of a pixel region of a semiconductor substrate; and a transfer gate having either of a concave and convex portion toward the floating diffusion region, the transfer gate being formed above the semiconductor substrate between the photodiode and the floating diffusion region by interposing a gate insulating film therebetween.
2 . The imaging device according to claim 1 , wherein the transfer gate includes an extending portion extending along an edge of the floating diffusion region in the lateral direction of the semiconductor substrate.
3 . The imaging device according to claim 1 , wherein the transfer gate includes a convex portion projecting to the floating diffusion region in the lateral direction of the semiconductor substrate.
4 . The imaging device according to claim 1 , wherein the transfer gate includes a concave portion recessed toward the photodiode in a portion overlapping the floating diffusion region in the lateral direction of the semiconductor substrate.Join the waitlist — get patent alerts
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