Inventor · disambiguated record
Naoya Saiki
Also filed as: SAIKI NAOYA
14 granted patents·15 pending applications·47 citations·filing 2004–2020
87Inventor score
Top patents by PatentIndex Score
29 records- 0190US7935574B2Marking method and sheet for both protective film forming and dicingLINTEC CORP·Filed 2005·Granted May 3, 2011·32 cites·12 claims
- 0279US7842551B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2007·Granted Nov 30, 2010·4 cites·18 claims
- 0375US10030174B2Composite sheet for forming protective filmLINTEC CORP·Filed 2014·Granted Jul 24, 2018·3 cites·7 claims
- 0472US7674859B2Adhesive composition and adhesive sheetLINTEC CORP·Filed 2008·Granted Mar 9, 2010·6 cites·2 claims
- 0557US7851335B2Adhesive composition, adhesive sheet and production method of semiconductor deviceLINTEC CORP·Filed 2009·Granted Dec 14, 2010·1 cites·12 claims
- 0654US12146081B2Peel-off detection labelLINTEC CORP·Filed 2019·Granted Nov 19, 2024·0 cites·20 claims
- 0752US10510578B2Protective film forming film, protective film forming sheet and work product manufacturing methodLINTEC CORP·Filed 2014·Granted Dec 17, 2019·0 cites·15 claims
- 0852US8247503B2Adhesive composition and adhesive sheetSAIKI NAOYA·Filed 2008·Granted Aug 21, 2012·1 cites·2 claims
- 0951US2009220783A1Adhesive Sheet for Dicing and Die BondingSHARP KK·Filed 2009·Application pending·0 cites
- 1048US10399306B2Protective film forming film, sheet for forming protective film, and inspection methodLINTEC CORP·Filed 2014·Granted Sep 3, 2019·0 cites·6 claims
- 1146US2021018521A1Method for measuring uptake performance of lipoproteinSYSMEX CORP·Filed 2020·Application pending·0 cites
- 1245US9562179B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2015·Granted Feb 7, 2017·0 cites·14 claims
- 1345US2008241995A1Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive SheetSHARP KK·Filed 2005·Application pending·0 cites
- 1444US9184082B2Adhesive composition, adhesive sheet and production process for semiconductor deviceSAIKI NAOYA·Filed 2007·Granted Nov 10, 2015·0 cites·14 claims
- 1544US2009246915A1Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor DeviceLINTEC CORP·Filed 2009·Application pending·0 cites
- 1644US2020018755A1Method for measuring an ability of high-density lipoprotein to uptake cholesterolSYSMEX CORP·Filed 2019·Application pending·0 cites
- 1744US2016176169A1Protective Film Formation-Use Composite SheetLINTEC CORP·Filed 2014·Application pending·0 cites
- 1844US2016185089A1Protective Film Formation-Use Composite SheetLINTEC CORP·Filed 2014·Application pending·0 cites
- 1943US2008242058A1Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor DeviceLINTEC CORP·Filed 2008·Application pending·0 cites
- 2043US2009053518A1Sheet for Forming a Protective Film for ChipsLINTEC CORP·Filed 2007·Application pending·0 cites
- 2142US2016326403A1Composite Sheet For Protective-Film FormationLINTEC CORP·Filed 2014·Application pending·0 cites
- 2242US2020264170A1Method for acquiring information on analyteSYSMEX CORP·Filed 2020·Application pending·0 cites
- 2340US2016086908A1Adhesive agent composition, adhesive sheet, and method for manufacturing semiconductor deviceLINTEC CORP·Filed 2014·Application pending·0 cites
- 2438US8545663B2Process for manufacturing semiconductor devicesYAMAZAKI OSAMU·Filed 2007·Granted Oct 1, 2013·0 cites·4 claims
- 2538US2005208296A1Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor deviceLINTEC CORP·Filed 2005·Application pending·0 cites
- 2637US10190017B2Protective film-forming film and method of manufacturing semiconductor chip with protective filmLINTEC CORP·Filed 2015·Granted Jan 29, 2019·0 cites·4 claims
- 2736US2006252234A1Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor deviceLINTEC CORP·Filed 2004·Application pending·0 cites
- 2835US2012162860A1Chip capacitor and method of manufacturing sameTAKETANI YUTAKA·Filed 2011·Application pending·0 cites
- 2933US9953946B2Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor deviceLINTEC CORP·Filed 2015·Granted Apr 24, 2018·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Naoya Saiki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →