Inventor · disambiguated record
Naohiro Shoda
Also filed as: SHODA NAOHIRO
11 granted patents·1 pending application·345 citations·filing 1993–2014
92Inventor score
Top patents by PatentIndex Score
12 records- 0197US9355886B2Conformal film deposition for gapfillNOVELLUS SYSTEMS INC·Filed 2013·Granted May 31, 2016·53 cites·14 claims
- 0294US8728958B2Gap fill integrationASHTIANI KAIHAN·Filed 2010·Granted May 20, 2014·26 cites·23 claims
- 0385US5529953AMethod of forming studs and interconnects in a multi-layered semiconductor deviceTOSHIBA AMERICA ELECTRONIC·Filed 1994·Granted Jun 25, 1996·75 cites·30 claims
- 0482US5937541ASemiconductor wafer temperature measurement and control thereof using gas temperature measurementSIEMENS AG·Filed 1997·Granted Aug 17, 1999·60 cites·6 claims
- 0578US6406545B2Semiconductor workpiece processing apparatus and methodTOSHIBA KK·Filed 1999·Granted Jun 18, 2002·55 cites·61 claims
- 0670US5689140AMethod for forming studs and interconnects in a multi-layered semiconductor deviceTOSHIBA KK·Filed 1996·Granted Nov 18, 1997·35 cites·14 claims
- 0753US2014302689A1Methods and apparatus for dielectric depositionNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 0850US5992046ASemiconductor wafer temperature measurement and control thereof using gas temperature measurementSIEMENS AG·Filed 1999·Granted Nov 30, 1999·13 cites·4 claims
- 0948US6150072AMethod of manufacturing a shallow trench isolation structure for a semiconductor deviceSIEMENS MICROELECTRONICS INC·Filed 1997·Granted Nov 21, 2000·15 cites·12 claims
- 1043US5652040AMagnetic recording mediumTOSHIBA KK·Filed 1995·Granted Jul 29, 1997·5 cites·11 claims
- 1139US5950099AMethod of forming an interconnectTOSHIBA KK·Filed 1996·Granted Sep 7, 1999·6 cites·23 claims
- 1236US5458947AMagnetic recording mediumTOSHIBA KK·Filed 1993·Granted Oct 17, 1995·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →