Inventor · disambiguated record
Naiya Soetan-Dodd
Also filed as: SOETAN-DODD NAIYA
0 granted patents·6 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0159US2025210491A1Vertically embedded utility patch for semiconductor packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0257US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 0355US2024332195A1Spray-coated photoresist and photoimageable dielectrics to enable tsv bridge for glass core packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0454US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 0554US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 0649US2025096052A1Localized thermal healing and doping of glass cores for microelectronic assembliesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →