Inventor · disambiguated record
Naoki Taya
Also filed as: TAYA NAOKI
17 granted patents·25 pending applications·18 citations·filing 2001–2022
89Inventor score
Top patents by PatentIndex Score
42 records- 0179US9525091B2Protective sheet for solar cell, manufacturing method thereof, and solar cell moduleTAKANASHI YASUNARI·Filed 2011·Granted Dec 20, 2016·4 cites·19 claims
- 0276US12159556B2Peeling detection labelLINTEC CORP·Filed 2020·Granted Dec 3, 2024·1 cites·20 claims
- 0374US8541087B2Pressure-sensitive adhesive, sheet for manufacturing an optical recording medium and optical recording mediumTAYA NAOKI·Filed 2009·Granted Sep 24, 2013·2 cites·11 claims
- 0470US9023913B2Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate bodyLINTEC CORP·Filed 2012·Granted May 5, 2015·1 cites·14 claims
- 0569US9558983B2Base film for dicing sheet and dicing sheetTAYA NAOKI·Filed 2012·Granted Jan 31, 2017·2 cites·20 claims
- 0668US8980399B2Pressure-sensitive adhesive sheetMORIOKA TAKASHI·Filed 2011·Granted Mar 17, 2015·1 cites·18 claims
- 0767US2024392166A1High-frequency dielectric heating adhesiveLINTEC CORP·Filed 2022·Application pending·0 cites
- 0867US2020010730A1Dielectric heating adhesive film and adhesion method using dielectric heating adhesive filmLINTEC CORP·Filed 2018·Application pending·0 cites
- 0967US2019352546A1Dielectric heating adhesive film and adhesion method using dielectric heating adhesive filmLINTEC CORP·Filed 2018·Application pending·0 cites
- 1063US8114520B2Laser dicing sheet and process for producing chip bodyWAKAYAMA YOJI·Filed 2007·Granted Feb 14, 2012·3 cites·18 claims
- 1162US8890400B2Luminescent composition and inorganic electroluminescent sheet using the sameNAGANAWA SATOSHI·Filed 2009·Granted Nov 18, 2014·2 cites·19 claims
- 1261US2023159795A1High-frequency dielectric heating adhesive sheetLINTEC CORP·Filed 2021·Application pending·0 cites
- 1360US12319852B2Method of bonding with adhesive sheets for high-frequency dielectric heatingLINTEC CORP·Filed 2021·Granted Jun 3, 2025·0 cites·10 claims
- 1458US2024052206A1Adhesive for high-frequency dielectric heating, structure, and method for manufacturing structureLINTEC CORP·Filed 2021·Application pending·0 cites
- 1558US2024002711A1Adhesive for high-frequency dielectric heating, structure, and method for manufacturing structureLINTEC CORP·Filed 2021·Application pending·0 cites
- 1658US2011039065A1Pressure-sensitive adhesive sheetLINTEC CORP·Filed 2009·Application pending·0 cites
- 1757US8691357B2Pressure-sensitive adhesive sheet for optical data recording medium, optical data recording medium, and method and device for reproducing data from optical data recording mediumTAYA NAOKI·Filed 2010·Granted Apr 8, 2014·1 cites·16 claims
- 1857US2016297179A1Base film for dicing sheet, dicing sheet comprising base film, and method of manufacturing base filmLINTEC CORP·Filed 2014·Application pending·0 cites
- 1957US2010255240A1Release sheet and pressure-sensitive adhesive articleLINTEC CORP·Filed 2008·Application pending·0 cites
- 2057US2016297180A1Base film for dicing sheet and method of manufacturing base filmLINTEC CORP·Filed 2014·Application pending·0 cites
- 2157US2023250316A1Adhesive agent for high-frequency induction heatingLINTEC CORP·Filed 2021·Application pending·0 cites
- 2257US2010310808A1Release sheet and pressure-sensitive adhesive articleLINTEC CORP·Filed 2008·Application pending·0 cites
- 2355US2023111471A1Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structureLINTEC CORP·Filed 2021·Application pending·0 cites
- 2455US2022176642A1Bonding method, and high-frequency dielectric heating adhesive sheetLINTEC orporation·Filed 2020·Application pending·0 cites
- 2552US10438831B2Base film for dicing sheets and dicing sheetLINTEC CORP·Filed 2014·Granted Oct 8, 2019·1 cites·17 claims
- 2652US2023321921A1Molded body, joining method, and method for producing molded bodyLINTEC CORP·Filed 2021·Application pending·0 cites
- 2750US8764505B2Process for producing an inorganic electroluminescent sheetNAGANAWA SATOSHI·Filed 2012·Granted Jul 1, 2014·0 cites·18 claims
- 2850US8174130B2Laser dicing sheet and manufacturing method for chip bodySATO YOSUKE·Filed 2007·Granted May 8, 2012·0 cites·20 claims
- 2950US2014069495A1Solar cell protective sheet, producing method of same, and solar cell moduleTAKANASHI YASUNARI·Filed 2012·Application pending·0 cites
- 3048US12359096B2High-frequency dielectric heating adhesive sheetLINTEC CORP·Filed 2021·Granted Jul 15, 2025·0 cites·11 claims
- 3148US2014308494A1Gas barrier film, method for producing same, gas barrier film laminate, member for electronic devices, and electronic deviceLINTEC CORP·Filed 2012·Application pending·0 cites
- 3245US9102833B2Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate bodyLINTEC CORP·Filed 2012·Granted Aug 11, 2015·0 cites·7 claims
- 3344US9546302B2Base film for dicing sheet and dicing sheetTAYA NAOKI·Filed 2012·Granted Jan 17, 2017·0 cites·15 claims
- 3443US2009261084A1Laser Dicing Sheet and Manufacturing Method For Chip BodyLINTEC CORP·Filed 2007·Application pending·0 cites
- 3543US2015348819A1Dicing sheet base film and dicing sheetLINTEC CORP·Filed 2013·Application pending·0 cites
- 3643US2015348820A1Dicing sheet base film and dicing sheetLINTEC CORP·Filed 2013·Application pending·0 cites
- 3741US2015357225A1Base film for dicing sheet and dicing sheet comprising sameLINTEC CORP·Filed 2013·Application pending·0 cites
- 3841US2012045612A1Pressure-sensitive adhesive sheetMORIOKA TAKASHI·Filed 2010·Application pending·0 cites
- 3938US2017036431A1Base film for dicing sheet, dicing sheet compresing base film, and method of manufacturing base filmLINTEC CORP·Filed 2015·Application pending·0 cites
- 4037US9315692B2Base material film for dicing sheet and dicing sheetTAYA NAOKI·Filed 2011·Granted Apr 19, 2016·0 cites·20 claims
- 4134US2002192412A1Heat shrinkable polyolefin filmFiled 2001·Application pending·0 cites
- 4232US2017121570A1Base film for dicing sheets and dicing sheetLINTEC CORP·Filed 2014·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Naoki Taya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →