Inventor · disambiguated record
Naoyuki Urasaki
Also filed as: URASAKI NAOYUKI
28 granted patents·2 pending applications·537 citations·filing 1993–2021
96Inventor score
Files withHITACHI CHEMICAL CO LTD14KOTANI HAYATO6SHENZHEN JUFEI OPTOELECTRONICS CO LTD5URASAKI NAOYUKI3HITACHI LTD1
Top patents by PatentIndex Score
30 records- 0194US10950767B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·6 cites·11 claims
- 0294US10326063B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 18, 2019·7 cites·12 claims
- 0393US6281450B1Substrate for mounting semiconductor chipsHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 28, 2001·206 cites·9 claims
- 0492US10205072B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 12, 2019·5 cites·18 claims
- 0589US5879568AProcess for producing multilayer printed circuit board for wire bondingHITACHI LTD·Filed 1997·Granted Mar 9, 1999·126 cites·8 claims
- 0684US5689879AMetal foil for printed wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1994·Granted Nov 25, 1997·46 cites·19 claims
- 0783US8212271B2Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereofKOTANI HAYATO·Filed 2008·Granted Jul 3, 2012·11 cites·13 claims
- 0880US9673362B2Optical semiconductor element mounting package, and optical semiconductor device using the sameURASAKI NAOYUKI·Filed 2007·Granted Jun 6, 2017·5 cites·14 claims
- 0979US5403672AMetal foil for printed wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·33 cites·10 claims
- 1078US11984545B2Method of manufacturing a light emitting deviceSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·0 cites·5 claims
- 1175US12426415B2Method of manufacturing an optical semiconductor deviceSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·21 claims
- 1275US12317657B2Optical semiconductor element mounting package and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted May 27, 2025·0 cites·14 claims
- 1375US8785525B2Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor deviceKOTANI HAYATO·Filed 2008·Granted Jul 22, 2014·7 cites·24 claims
- 1474US11810778B2Optical semiconductor element mounting package and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·21 claims
- 1574US5638598AProcess for producing a printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jun 17, 1997·38 cites·26 claims
- 1673US8585272B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateKOTANI HAYATO·Filed 2009·Granted Nov 19, 2013·6 cites·3 claims
- 1773US8343616B2Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 1, 2013·4 cites·2 claims
- 1870US9387608B2Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin compositionKOTANI HAYATO·Filed 2007·Granted Jul 12, 2016·2 cites·20 claims
- 1968US9608184B2Optical semiconductor element mounting package, and optical semiconductor device using the sameURASAKI NAOYUKI·Filed 2011·Granted Mar 28, 2017·1 cites·10 claims
- 2064US10381533B2Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflectionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 13, 2019·0 cites·14 claims
- 2160US9076932B2Optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2014·Granted Jul 7, 2015·0 cites·18 claims
- 2259US9660156B2Optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted May 23, 2017·0 cites·13 claims
- 2357US5444189APrinted wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Aug 22, 1995·19 cites·9 claims
- 2454US9067906B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 30, 2015·0 cites·2 claims
- 2553US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 2651US8367153B2Method of using white resin in an electronic deviceHITACHI CHEMICAL CO LTD·Filed 2011·Granted Feb 5, 2013·0 cites·13 claims
- 2749US8421113B2Electronic device incorporating the white resinURASAKI NAOYUKI·Filed 2011·Granted Apr 16, 2013·0 cites·16 claims
- 2847US2013001622A1Substrate for mounting optical semiconductor element and manufacturing method thereof, optical semiconductor device and manufacturing method for thereofKOTANI HAYATO·Filed 2012·Application pending·0 cites
- 2946US8637593B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateKOTANI HAYATO·Filed 2010·Granted Jan 28, 2014·0 cites·2 claims
- 3039US2011297424A1Wiring board, electronic device package, and methods of production of the sameYOSHIDA HIDEKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →