Inventor · disambiguated record
Naoko Yamaguchi
Also filed as: YAMAGUCHI NAOKO
26 granted patents·18 pending applications·145 citations·filing 2000–2024
95Inventor score
Top patents by PatentIndex Score
44 records- 0188US8746131B2Drip bagSAITOH MITSUNORI·Filed 2008·Granted Jun 10, 2014·32 cites·12 claims
- 0285US8822307B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodYAMAGUCHI NAOKO·Filed 2012·Granted Sep 2, 2014·10 cites·10 claims
- 0384US9732453B2Nonwoven fabric sheet, and extraction filter and extraction bag using the sameOHKI CO LTD·Filed 2015·Granted Aug 15, 2017·4 cites·4 claims
- 0483US8778778B2Manufacturing method of semiconductor device, semiconductor substrate, and camera moduleTANIDA KAZUMASA·Filed 2011·Granted Jul 15, 2014·8 cites·7 claims
- 0576US11413662B2Substrate cleaning apparatus and substrate cleaning methodSCREEN HOLDINGS CO LTD·Filed 2017·Granted Aug 16, 2022·2 cites·22 claims
- 0675US7498281B2Nonwoven fabric and tea bagASAHI KASEI FIBERS CORP·Filed 2003·Granted Mar 3, 2009·29 cites·10 claims
- 0773US7370412B2Method for connecting electronic deviceTOSHIBA KK·Filed 2003·Granted May 13, 2008·21 cites·6 claims
- 0870US2023290442A1Method, manufacturing method, design device, design program, and recording medium for primer for amplicon methylation sequence analysisFUJIFILM CORP·Filed 2023·Application pending·0 cites
- 0967US2024229114A1Production method of biomarker set for cancer detectionFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 1067US2023054019A1Calculation method for base methylation degree and programFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1166US9873141B2Filler layer forming methodSCREEN HOLDINGS CO LTD·Filed 2016·Granted Jan 23, 2018·1 cites·14 claims
- 1266US7877871B2Method of manufacturing an electronic circuit formed on a substrateTOSHIBA KK·Filed 2008·Granted Feb 1, 2011·2 cites·2 claims
- 1364US2010330236A1Fiber sheetOHKI CO LTD·Filed 2009·Application pending·0 cites
- 1463US7433637B2Image forming apparatus and method of manufacturing electronic circuit using the sameKABSUSHIKI KAISHA TOSHIBA·Filed 2005·Granted Oct 7, 2008·4 cites·12 claims
- 1562US7469941B2Method of producing a wiring boardTOSHIBA KK·Filed 2006·Granted Dec 30, 2008·1 cites·6 claims
- 1662US6486001B1Fabricating method of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Nov 26, 2002·12 cites·15 claims
- 1761US6977130B2Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuitTOSHIBA KK·Filed 2003·Granted Dec 20, 2005·10 cites·22 claims
- 1861US2025115418A1Extraction bag, method for manufacturing extraction bag, sheet for extraction bag, and method for manufacturing sheet for extraction bagOHKI CO LTD·Filed 2022·Application pending·0 cites
- 1959US8309430B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodTANIDA KAZUMASA·Filed 2011·Granted Nov 13, 2012·1 cites·20 claims
- 2057US11919051B2Substrate cleaning apparatus and substrate cleaning methodSCREEN HOLDINGS CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·36 claims
- 2156US2016176172A1Fiber sheetOHKI CO LTD·Filed 2016·Application pending·0 cites
- 2253US2024252117A1Magnetic resonance imaging apparatus and table apparatusCANON MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 2353US2019056383A1Biological sample evaluation system, biological sample evaluation method, and biological sample evaluation control programFUJIFILM CORP·Filed 2018·Application pending·0 cites
- 2453US2005053772A1Wiring board and multilayer wiring boardFiled 2004·Application pending·0 cites
- 2552US8220147B2Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuitYAMAGUCHI NAOKO·Filed 2009·Granted Jul 17, 2012·0 cites·7 claims
- 2651US8609511B2Semiconductor device manufacturing method, semiconductor device, and camera moduleSHIRONO TAKASHI·Filed 2011·Granted Dec 17, 2013·0 cites·7 claims
- 2751US7312621B2Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereofTOSHIBA KK·Filed 2003·Granted Dec 25, 2007·5 cites·12 claims
- 2850US10882688B2Sheet material for extraction, extraction filter, and extraction bagOHKI CO LTD·Filed 2017·Granted Jan 5, 2021·0 cites·6 claims
- 2946US7939171B2Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuitTOSHIBA KK·Filed 2004·Granted May 10, 2011·1 cites·11 claims
- 3046US2005016382A1Percolation sheetFiled 2002·Application pending·0 cites
- 3146US2005224253A1Wiring board and production method of wiring boardAOKI HIDEO·Filed 2005·Application pending·0 cites
- 3245US7414417B2Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic partsTOSHIBA KK·Filed 2004·Granted Aug 19, 2008·2 cites·15 claims
- 3345US7350297B2Method of manufacturing a wiring substrateTOSHIBA KK·Filed 2006·Granted Apr 1, 2008·0 cites·5 claims
- 3443US10548427B2Sheet for extraction, extraction filter, and extraction bagOHKI CO LTD·Filed 2016·Granted Feb 4, 2020·0 cites·12 claims
- 3543US7259046B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2005·Granted Aug 21, 2007·0 cites·3 claims
- 3643US2005279996A1Organic semiconductor element and manufacturing method thereofTAKUBO CHIAKI·Filed 2005·Application pending·0 cites
- 3742US7067398B2Method of producing electronic circuit and electronic circuitTOSHIBA TEC KK·Filed 2005·Granted Jun 27, 2006·0 cites·4 claims
- 3842US2005158527A1Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuitFiled 2004·Application pending·0 cites
- 3940US7486921B2Method of producing electronic circuit, and electronic circuit substrateTOSHIBA KK·Filed 2004·Granted Feb 3, 2009·0 cites·9 claims
- 4039US2005153249A1Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic componentTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4139US2004112633A1Electronic device moduleFiled 2003·Application pending·0 cites
- 4238US2012190138A1Semiconductor manufacturing apparatus and semiconductor substrate bonding methodTANIDA KAZUMASA·Filed 2012·Application pending·0 cites
- 4337US2005227158A1Toner for producing wiring board and method of producing wiring board using thereofTOSHIBA TEC KK·Filed 2005·Application pending·0 cites
- 4437US2011304003A1Semiconductor device, camera module, and manufacturing method of semiconductor deviceTANIDA KAZUMASA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →