Wiring board and production method of wiring board

Abstract

A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

1 . A wiring board, comprising: 
 a substrate;    a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and    a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.    
   
   
       2 . A wiring board according to  claim 1 , wherein the fine metal particles adhered to the surface of the resin layer are adhered to the surface of the resin layer by either adsorption of a metal complex or metal ion or direct adhesion of the fine metal particles.  
   
   
       3 . A wiring board according to  claim 1 , wherein the resin which forms the resin layer is a thermoplastic resin or a thermosetting resin.  
   
   
       4 . A wiring board, comprising: 
 a substrate;    a first resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface;    a conductive first metal layer which is formed on the first resin layer with the fine metal particles interposed between them;    a second resin layer which is selectively formed to partly cover the first metal layer;    a third resin layer which is selectively formed on part of the surface of the first metal layer and on the second resin layer and has the fine metal particles contained or adhered to its surface;    a conductive second metal layer which is formed on part of the surface of the first metal layer and on the third resin layer with the fine metal particles partly interposed between them; and    a fourth resin layer which is selectively formed on the second resin layer and the second metal layer.    
   
   
       5 . A method of producing a wiring board, comprising: 
 selectively arranging resin particles, which have a resin as a main component and have fine metal particles contained or adhered to their surfaces, on one main surface of a substrate;    fixing the resin particles to one main surface of the substrate; and    plating metal on the fixed resin layer with the fine metal particles used as plating nuclei.    
   
   
       6 . A method of producing a wiring board according to  claim 5 , wherein the fine metal particles adhered to the surface of the resin layer are adhered to the surface of the resin layer by either adsorption of a metal complex or metal ion or direct adhesion of the fine metal particles.  
   
   
       7 . A method of producing a wiring board according to  claim 5 , further comprising a reducing step for reducing the adsorbed fine metal particles prior to the metal plating step when the resin particles which have the fine metal particles adhered to the surfaces of the particles by adsorption of a metal complex or metal ion are used.  
   
   
       8 . A method of producing a wiring board according to  claim 5 , further comprising an etching step for protruding at least the fine metal particles in part by an etching treatment prior to the metal plating step when the resin particles containing the fine metal particles are used.  
   
   
       9 . A method of producing a wiring board according to  claim 5 , wherein the resin particles are disposed on the substrate in the arranging step by a method selected from offset printing, relief printing, engraved printing, stencil printing and surface printing.  
   
   
       10 . A method of producing a wiring board according to  claim 5 , wherein the arranging step is comprised of disposing a solution, which has the resin particles dispersed into a solvent, on the substrate and drying to evaporate the solvent to remain the resin particles on the substrate.