Inventor · disambiguated record
Nee Seng Ling
Also filed as: LING NEE S · LING NEE SENG
2 granted patents·2 pending applications·54 citations·filing 2000–2011
57Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0179US6225144B1Method and machine for underfilling an assembly to form a semiconductor packageMOTOROLA INC·Filed 2000·Granted May 1, 2001·54 cites·5 claims
- 0238US2010096735A1Clamping assemblyROKKO TECHNOLOGY PTE LTD·Filed 2007·Application pending·0 cites
- 0334US8061583B2Ball mounting apparatus and methodLING NEE SENG·Filed 2007·Granted Nov 22, 2011·0 cites·9 claims
- 0429US2012031954A1Ball Mounting Apparatus and MethodLING NEE SENG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →