Ball Mounting Apparatus and Method

Abstract

A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder halls to the first plate.

1 . A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising:
 a first plate for receiving a first substrate in a loading position;   said first plate adapted to subsequently translate laterally from a substrate loading position to a flux receiving position;   said first plate further adapted to subsequently rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position for mounting solder balls to the first plate.   
     
     
         2 . The device according to  claim 1 , further including:
 a second plate, simultaneously rotatable with the first plate, such that the first plate is in a ball receiving position, and the second plate is in the loading position.   
     
     
         3 . The device according to  claim 1 , wherein the flux receiving position includes:
 a flux applicator adapted to sweep across a surface at a pre-determined height;   a flux template for pressing to the surface, so as to pick up flux on the template and apply said flux to the substrate in a pattern determined by the template.   
     
     
         4 . The device according to  claim 1 , wherein the solder ball receiving position includes:
 a ball template having vacuum apertures in an orientation to match that required on the substrate, said apertures adapted to receive the solder balls;   a ball suction tool arranged to be brought into proximity with the template, such that the ball suction tool is capable of mounting the solder balls to the substrate in the pre-determined orientation of the ball template.   
     
     
         5 . A rotary conveyor assembly comprising:
 a first and second actuator, the first actuator arranged to move the second actuator in a reciprocating motion;   a rotary link adapted to rotate about a rotational fixture and rotationally mounted to the second actuator at a first end, such that the second actuator is arranged to move the first end in a reciprocating motion; and   said rotary link having a conveyor mounting mounted adjacent to the first end.   
     
     
         6 . The rotary conveyor assembly according to  claim 5 , wherein the rotary link further includes a slide such that the conveyor mounting to permit relative linear movement with the rotational fixture. 
     
     
         7 . The rotary conveyor assembly according to  claim 5 , wherein the first and second actuator are arranged to interact such that the conveyor mounting is capable of following a circular path. 
     
     
         8 . The rotary conveyor assembly according to  claim 7 , wherein the circular path followed by the conveyor mounting includes a first point and a diametrically opposed second point. 
     
     
         9 . The rotary conveyor assembly according to  claim 8 , wherein the slide is arranged to diametrically extend the conveyor mounting from the second point to a third point. 
     
     
         10 . The rotary conveyor assembly according to  claim 9 , wherein the slide is arranged to diametrically extend the conveyor mounting from the first point to a fourth point. 
     
     
         11 . The rotary conveyor assembly according to  claim 6 , wherein the first end is mounted to the second actuator through a bracket in direct engagement with the second actuator. 
     
     
         12 . The rotary conveyor assembly according to  claim 6 , wherein the second actuator is mounted to the first actuator through an actuator plate mounted directly to the first actuator. 
     
     
         13 . The rotary conveyor assembly according to  claim 11 , wherein on actuation by the second actuator, the bracket is arranged to move reciprocately along the actuator plate. 
     
     
         14 . The rotary conveyor assembly according to  claim 11 , wherein the first and second actuators are rotary actuators rotating the ball screws, and respectively engage the actuator plate and bracket in a screw thread arrangement, such that actuation of the rotary actuators results in linear movement of the actuator plate and bracket. 
     
     
         15 . The rotary conveyor assembly according to  claim 6 , further including a third actuator, the first actuator arranged to move the third actuator in a reciprocating motion;
 the rotary link adapted rotationally mounted to the third actuator at a second end, such that the third actuator is arranged to move the second end in a reciprocating motion;   said rotary link having a second conveyor mounting mounted adjacent to the second end.   
     
     
         16 . The rotary conveyor assembly according to  claim 15 , wherein the first actuator moves the second actuator along a first axis, and the second actuator moves the first end along a second axis, said first and second axes arranged orthogonal to each other. 
     
     
         17 . A template assembly comprising;
 a template for receiving solder balls;   a reservoir housing for containing a plurality of solder balls, said reservoir housing arranged to move over said template and distribute the solder balls within said template; and   a fluid interface device for providing a fluid interface between the template and reservoir housing.   
     
     
         18 . The template assembly according to  claim 17 , wherein the reservoir housing encapsulates a void into which the solder balls are placed, said housing further including an orifice in an underside face of said housing through which the solder balls are distributed to the template. 
     
     
         19 . The template assembly according to  claim 17 , wherein the fluid interface maintains the reservoir housing at a predetermined distance above said template. 
     
     
         20 . The template assembly according to  claim 17 , wherein the fluid of said fluid interface is air. 
     
     
         21 . The template assembly according to  claim 17 , wherein the fluid interface device is integral with the reservoir housing the fluid interface device comprising an air inlet in communication with an external air supply; a plurality of apertures in the underside face through which the air exit to form the fluid interface said apertures and inlet connected by at least one air channel. 
     
     
         22 . The template assembly according to  claim 21 , wherein said apertures are arranged in two groups, said groups located adjacent to opposed ends of said underside face. 
     
     
         23 . The template assembly according to  claim 21 , wherein said fluid interface is located intermediate said apertures and a running surface of said template. 
     
     
         24 . The template assembly according to  claim 17 , wherein the reservoir housing is mounted on a linear slide for moving the reservoir housing along the template. 
     
     
         25 . The template assembly according to  claim 17 , wherein said underside face further includes two ridges separating a central portion of the underside face from the apertures, such that a central portion of the underside face is positioned above said opposed ends during distribution of said solder balls. 
     
     
         26 . A delivery device for delivery flux to a flux pool comprising;
 a flux containment chamber;   a first pressure source for applying pressure to the contained flux within the containment chamber;   an exit chamber;   a nozzle, such that under pressure flux moves from the containment chamber through the exit chamber and exits the nozzle; and   wherein the exit chamber comprises a second pressure source for applying pressure to flux within the exit chamber.   
     
     
         27 . The device according to  claim 26 , wherein the flux containment chamber includes a barrel of a syringe and the first pressure source includes a selectively operable plunger arranged to slide down the barrel so as to apply pressure to the flux within the containment chamber. 
     
     
         28 . The device according to  claim 26 , wherein the second pressure source comprises an inlet in communication with a pressurized air source such that on activation of the second pressure source, pressurized air is applied to flux in the exit chamber to force said flux from the exit chamber and out of said nozzle. 
     
     
         29 . A device according to  claim 26 , further including a sensor for sensing a quantity of flux within the barrel such that on reaching a predetermined minimum quantity, the sensor will output a signal to prompt an operator to remove said barrel. 
     
     
         30 . An adaptor plate assembly for mounting a pick up head to a solder ball placement machine, the adaptor plate comprising;
 a plate having a central orifice;   a resilient engagement portion having a plurality of resilient depressible projections located on a peripheral edge of said plate for resiliently engaging corresponding recesses in the solder ball placement machines;   a plurality of location holes on a first face of said plate arranged to correspond with projections from the pick up head; and   engagement portions for releaseably engaging the pick up head.   
     
     
         31 . The adaptor plate according to  claim 30  wherein further including an inlet on one face and an outlet on an opposed second face having channels connecting said inlet and outlet so as to pass a vacuum through said plate. 
     
     
         32 . The adaptor plate according to  claim 30 , further including steel bushings for insertion in the location holes. 
     
     
         33 . The adaptor plate according to  claim 30 , wherein said plate is made from aluminum. 
     
     
         34 . The adaptor plate according to  claim 30 , wherein said plate is adapted to be press fit into engagement with said solder ball placement machine using said resilient projections. 
     
     
         35 . The adaptor plate according to  claim 32 , wherein said bushings include centrally placed apertures, said apertures sized so as to correspond to projections from said solder ball placement machine. 
     
     
         36 . The adaptor plate according to  claim 30 , wherein said pick up head is one of a solder ball pick up head or a flux pick up head.