Inventor · disambiguated record
Neha M. Patel
Also filed as: PATEL NEHA · PATEL NEHA M · PATEL NEHA MANUBHAI
11 granted patents·8 pending applications·54 citations·filing 2005–2022
88Inventor score
Files withINTEL CORP6RARAVIKAR NACHIKET R4EMCURE PHARMACEUTICALS LTD3FARAHANI MOHAMMAD M3MEDTRONIC INC2
Top patents by PatentIndex Score
19 records- 0192US7553681B2Carbon nanotube-based stress sensorINTEL CORP·Filed 2006·Granted Jun 30, 2009·26 cites·12 claims
- 0291US9028142B2Integrated microelectronic package temperature sensorRARAVIKAR NACHIKET R·Filed 2012·Granted May 12, 2015·13 cites·10 claims
- 0389US11380643B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 0480US10583101B2Lipid formulations of carmustineEMCURE PHARMACEUTICALS LTD·Filed 2017·Granted Mar 10, 2020·2 cites·18 claims
- 0577US10797014B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2016·Granted Oct 6, 2020·2 cites·11 claims
- 0677US8174084B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2006·Granted May 8, 2012·5 cites·10 claims
- 0776US8586393B2Stress sensor for in-situ measurement of package-induced stress in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2012·Granted Nov 19, 2013·3 cites·15 claims
- 0874US11784150B2Rounded metal trace corner for stress reductionINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0964US10224299B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2016·Granted Mar 5, 2019·1 cites·14 claims
- 1054US10515914B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2019·Granted Dec 24, 2019·0 cites·19 claims
- 1152US2025070008A1Electrical component and method of forming sameMEDTRONIC INC·Filed 2022·Application pending·0 cites
- 1252US2025070009A1Electrical component and method of forming sameMEDTRONIC INC·Filed 2022·Application pending·0 cites
- 1350US10278946B2Liquid formulation of cabazitaxelEMCURE PHARMACEUTICALS LTD·Filed 2018·Granted May 7, 2019·0 cites·4 claims
- 1450US2014013855A1Deflection sensor for in-situ deflection measurement in semiconductor devicesFARAHANI MOHAMMAD M·Filed 2013·Application pending·0 cites
- 1548US2008002755A1Integrated microelectronic package temperature sensorRARAVIKAR NACHIKET R·Filed 2006·Application pending·0 cites
- 1641US2008237822A1Microelectronic die having nano-particle containing passivation layer and package including sameRARAVIKAR NACHIKET R·Filed 2007·Application pending·0 cites
- 1741US2007107500A1Sensing moisture uptake of package polymersPATEL NEHA·Filed 2005·Application pending·0 cites
- 1837US2018311203A1Liquid formulation of cabazitaxelEMCURE PHARMACEUTICALS LTD·Filed 2016·Application pending·0 cites
- 1935US2007298525A1Integrated microelectronic package stress sensorRARAVIKAR NACHIKET R·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →