Integrated microelectronic package temperature sensor

Abstract

Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.

1 . A method comprising:
 using carbon nanotubes to measure temperature on a microelectronic integrated circuit.   
     
     
         2 . The method of  claim 1  including forming a pair of spaced apart vertical structures on a substrate and growing carbon nanotubes between said vertical structures. 
     
     
         3 . The method of  claim 2  including forming a unit by reducing the thickness of said substrate. 
     
     
         4 . The method of  claim 3  including securing said unit to an integrated circuit. 
     
     
         5 . The method of  claim 3  including securing said unit to a package component of a microelectronic integrated circuit. 
     
     
         6 . The method of  claim 5  including securing said unit to a first level interconnect. 
     
     
         7 . The method of  claim 5  including securing said unit to a second level interconnect. 
     
     
         8 . The method of  claim 6  including providing current to said unit in a first level interconnect through a second level interconnect. 
     
     
         9 . The method of  claim 1  including providing a plurality of carbon nanotubes extending across adjacent interconnects. 
     
     
         10 . The method of  claim 1  including providing at least two carbon nanotubes on the back side of an integrated circuit die to measure temperature on said die. 
     
     
         11 . A microelectronic component comprising:
 a microelectronic element; and   a pair of carbon nanotubes supported on said element to measure the temperature of said element.   
     
     
         12 . The component of  claim 11  wherein said component is a first level interconnect. 
     
     
         13 . The component of  claim 11  wherein said component is a second level interconnect. 
     
     
         14 . The component of  claim 11  wherein said component is part of an integrated circuit package. 
     
     
         15 . The component of  claim 11  wherein said component is an integrated circuit die. 
     
     
         16 . The component of  claim 15  including carbon nanotubes on opposite sides of said die. 
     
     
         17 . The component of  claim 11  wherein said carbon nanotubes are mounted on a substrate secured to said component. 
     
     
         18 . The component of  claim 17  wherein said carbon nanotubes are glued to said component. 
     
     
         19 . The component of  claim 11  wherein said component is a first level interconnect and is coupled to a second level interconnect. 
     
     
         20 . The component of  claim 11  wherein said carbon nanotubes extend between a pair of metallic structures. 
     
     
         21 . A system comprising:
 a processor;   a dynamic random access memory coupled to said processor; and   said processor including a microelectronic element and a pair of carbon nanotubes supported on said element to measure the temperature of said element.   
     
     
         22 . The system of  claim 21  wherein said processor is in the form of a die having carbon nanotubes on two opposed sides of said die. 
     
     
         23 . The system of  claim 21  wherein said processor includes a package and carbon nanotubes on said package. 
     
     
         24 . The system of  claim 21  wherein said processor includes a die having carbon nanotubes formed on at least one side thereof. 
     
     
         25 . The system of  claim 21  wherein said carbon nanotubes are formed on a substrate and secured to said die.