Inventor · disambiguated record
Nicholas K. Eib
Also filed as: EIB NICHOLAS · EIB NICHOLAS K
30 granted patents·3 pending applications·2,713 citations·filing 1995–2012
98Inventor score
Files withLSI LOGIC CORP20LSI CORP7ASML NETHERLANDS BV1AVAGO TECHNOLOGIES GENERAL IP1EIB NICHOLAS K1
Top patents by PatentIndex Score
33 records- 0199US6269472B1Optical proximity correction method and apparatusLSI LOGIC CORP·Filed 1997·Granted Jul 31, 2001·356 cites·22 claims
- 0299US5705301APerforming optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1996·Granted Jan 6, 1998·491 cites·18 claims
- 0398US6282696B1Performing optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1999·Granted Aug 28, 2001·278 cites·17 claims
- 0498US5723233AOptical proximity correction method and apparatusLSI LOGIC CORP·Filed 1996·Granted Mar 3, 1998·323 cites·17 claims
- 0597US6425117B1System and method for performing optical proximity correction on the interface between optical proximity corrected cellsLSI LOGIC CORP·Filed 1997·Granted Jul 23, 2002·393 cites·18 claims
- 0697US5682323ASystem and method for performing optical proximity correction on macrocell librariesLSI LOGIC CORP·Filed 1995·Granted Oct 28, 1997·375 cites·9 claims
- 0792US5900338APerforming optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1997·Granted May 4, 1999·86 cites·13 claims
- 0891US6499003B2Method and apparatus for application of proximity correction with unitary segmentationLSI LOGIC CORP·Filed 1998·Granted Dec 24, 2002·88 cites·13 claims
- 0990US6413881B1Process for forming thin gate oxide with enhanced reliability by nitridation of upper surface of gate of oxide to form barrier of nitrogen atoms in upper surface region of gate oxide, and resulting productLSI LOGIC CORP·Filed 2000·Granted Jul 2, 2002·60 cites·10 claims
- 1079US6532585B1Method and apparatus for application of proximity correction with relative segmentationLSI LOGIC CORP·Filed 2000·Granted Mar 11, 2003·15 cites·35 claims
- 1178US6109775AMethod for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereonLSI LOGIC CORP·Filed 1997·Granted Aug 29, 2000·60 cites·18 claims
- 1277US7499146B2Lithographic apparatus and device manufacturing method, an integrated circuit, a flat panel display, and a method of compensating for cuppingASML NETHERLANDS BV·Filed 2005·Granted Mar 3, 2009·4 cites·19 claims
- 1376US5893952AApparatus for rapid thermal processing of a waferLSI LOGIC CORP·Filed 1997·Granted Apr 13, 1999·38 cites·20 claims
- 1473US7313508B2Process window compliant corrections of design layoutLSI CORP·Filed 2002·Granted Dec 25, 2007·13 cites·25 claims
- 1572US9188848B2Maskless vortex phase shift optical direct write lithographyAVAGO TECHNOLOGIES GENERAL IP·Filed 2012·Granted Nov 17, 2015·1 cites·23 claims
- 1672US8012873B1Method for providing temperature uniformity of rapid thermal annealingSUVOLTA INC·Filed 2009·Granted Sep 6, 2011·3 cites·16 claims
- 1771US7189498B2Process and apparatus for generating a strong phase shift optical pattern for use in an optical direct write lithography processLSI LOGIC CORP·Filed 2004·Granted Mar 13, 2007·11 cites·23 claims
- 1871US5897381AMethod of forming a layer and semiconductor substrateLSI LOGIC CORP·Filed 1997·Granted Apr 27, 1999·30 cites·25 claims
- 1970US6175953B1Method and apparatus for general systematic application of proximity correctionLSI LOGIC CORP·Filed 1998·Granted Jan 16, 2001·29 cites·30 claims
- 2069US6809824B1Alignment process for integrated circuit structures on semiconductor substrate using scatterometry measurements of latent images in spaced apart test fields on substrateLSI LOGIC CORP·Filed 2001·Granted Oct 26, 2004·12 cites·19 claims
- 2166US7372547B2Process and apparatus for achieving single exposure pattern transfer using maskless optical direct write lithographyLSI CORP·Filed 2004·Granted May 13, 2008·8 cites·41 claims
- 2257US7264906B2OPC based illumination optimization with mask error constraintsLSI CORP·Filed 2004·Granted Sep 4, 2007·4 cites·9 claims
- 2356US8377633B2Maskless vortex phase shift optical direct write lithographyLSI CORP·Filed 2011·Granted Feb 19, 2013·0 cites·10 claims
- 2456US5756369ARapid thermal processing using a narrowband infrared source and feedbackLSI LOGIC CORP·Filed 1996·Granted May 26, 1998·15 cites·13 claims
- 2555US7270942B2Optimized mirror design for optical direct writeLSI CORP·Filed 2004·Granted Sep 18, 2007·4 cites·4 claims
- 2654US6174630B1Method of proximity correction with relative segmentationLSI LOGIC CORP·Filed 1998·Granted Jan 16, 2001·12 cites·18 claims
- 2749US7738078B2Optimized mirror design for optical direct writeLSI CORP·Filed 2007·Granted Jun 15, 2010·0 cites·10 claims
- 2843US8057963B2Maskless vortex phase shift optical direct write lithographyEIB NICHOLAS K·Filed 2004·Granted Nov 15, 2011·1 cites·26 claims
- 2939US2005151949A1Process and apparatus for applying apodization to maskless optical direct write lithography processesLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 3037US2005014075A1Phase edge darkening binary masksFiled 2003·Application pending·0 cites
- 3137US2004241554A1Ion implantation phase shift maskLSI LOGIC CORP MILPITAS CA·Filed 2003·Application pending·0 cites
- 3234US7634389B2Reflectivity optimization for multilayer stacksLSI CORP·Filed 2003·Granted Dec 15, 2009·0 cites·18 claims
- 3334US6759337B1Process for etching a controllable thickness of oxide on an integrated circuit structure on a semiconductor substrate using nitrogen plasma and plasma and an rf bias applied to the substrateLSI LOGIC CORP·Filed 1999·Granted Jul 6, 2004·3 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →