Inventor · disambiguated record
Nico Lange
Also filed as: LANGE NICO
4 granted patents·1 pending application·1 citations·filing 2014–2024
57Inventor score
Top patents by PatentIndex Score
5 records- 0187US12028987B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2022·Granted Jul 2, 2024·1 cites·12 claims
- 0281US12349287B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0355US9199294B2Method and device for manufacturing a corrugated metal pipeNEXANS·Filed 2014·Granted Dec 1, 2015·0 cites·4 claims
- 0445US2014305178A1Device for undulating a pipeNEXANS·Filed 2014·Application pending·0 cites
- 0543US11561358B2Method for the continuous production of optical fibre waveguide sensors mounted in a perforated metal hollow profileNEXANS·Filed 2020·Granted Jan 24, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →