Inventor · disambiguated record
Nick Ray Linebarger, Jr.
Also filed as: LINEBARGER JR NICK RAY · LINEBARGER NICK
16 granted patents·12 pending applications·61 citations·filing 2014–2024
92Inventor score
Files withLAM RES CORP28
Top patents by PatentIndex Score
28 records- 0197US11725283B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Aug 15, 2023·5 cites·13 claims
- 0297US11441222B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Sep 13, 2022·7 cites·20 claims
- 0396US10851457B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2017·Granted Dec 1, 2020·14 cites·13 claims
- 0495US11946142B2Spatially tunable deposition to compensate within wafer differential bowLAM RES CORP·Filed 2020·Granted Apr 2, 2024·4 cites·20 claims
- 0594US11634817B2Substrate pedestal including backside gas-delivery tubeLAM RES CORP·Filed 2020·Granted Apr 25, 2023·3 cites·16 claims
- 0694US10655225B2Substrate pedestal module including backside gas delivery tube and method of makingLAM RES CORP·Filed 2017·Granted May 19, 2020·4 cites·13 claims
- 0794US9738975B2Substrate pedestal module including backside gas delivery tube and method of makingLAM RES CORP·Filed 2015·Granted Aug 22, 2017·10 cites·15 claims
- 0890US11851760B2PECVD deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2021·Granted Dec 26, 2023·1 cites·11 claims
- 0987US11408734B2Distance measurement between gas distribution device and substrate support at high temperaturesLAM RES CORP·Filed 2019·Granted Aug 9, 2022·2 cites·24 claims
- 1086US2024309507A1Pecvd deposition system for deposition on selective side of the substrateLAM RES CORP·Filed 2024·Application pending·0 cites
- 1182US10872747B2Controlling showerhead heating via resistive thermal measurementsLAM RES CORP·Filed 2018·Granted Dec 22, 2020·4 cites·25 claims
- 1281US12398464B2Substrate pedestal including backside gas-delivery tubeLAM RES CORP·Filed 2023·Granted Aug 26, 2025·0 cites·17 claims
- 1379US12050112B2Distance measurement between gas distribution device and substrate support at high temperaturesLAM RES CORP·Filed 2022·Granted Jul 30, 2024·0 cites·24 claims
- 1478US10903070B2Asymmetric wafer bow compensation by chemical vapor depositionLAM RES CORP·Filed 2018·Granted Jan 26, 2021·2 cites·19 claims
- 1576US10242848B2Carrier ring structure and chamber systems including the sameLAM RES CORP·Filed 2014·Granted Mar 26, 2019·5 cites·24 claims
- 1673US12338531B2Spatially tunable deposition to compensate within wafer differential bowLAM RES CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 1773US2021108314A1Methods for Depositing a Film on a Backside of a SubstrateLAM RES CORP·Filed 2020·Application pending·0 cites
- 1853US2025118592A1Apparatuses for backside wafer processing with edge-only wafer contactLAM RES CORP·Filed 2023·Application pending·0 cites
- 1951US2023250524A1Friction stir processing for corrosion resistanceLAM RES CORP·Filed 2021·Application pending·0 cites
- 2050US2022415624A1Carrier ring to pedestal kinematic mount for substrate processing toolsLAM RES CORP·Filed 2020·Application pending·0 cites
- 2150US2025283221A1Carrier ring with tabsLAM RES CORP·Filed 2023·Application pending·0 cites
- 2249US2025003069A1Dry process tool with adjustable flow valveLAM RES CORP·Filed 2022·Application pending·0 cites
- 2349US2024371679A1Clockable substrate processing pedestal for use in semiconductor fabrication toolsLAM RES CORP·Filed 2021·Application pending·0 cites
- 2448US2023238223A1Carrier rings with radially-varied plasma impedanceLAM RES CORP·Filed 2021·Application pending·0 cites
- 2548US2023352279A1Multi-station processing tools with station-varying support features for backside processingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2647US12272591B2Friction stir welding in semiconductor manufacturing applicationsLAM RES CORP·Filed 2020·Granted Apr 8, 2025·0 cites·34 claims
- 2746US2023052089A1In situ surface coating of process chamberLAM RES CORP·Filed 2021·Application pending·0 cites
- 2845US2023052543A1Decoupling radiofrequency (rf) signals from input signal conductors of a process chamberLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →