Inventor · disambiguated record
Niels Oeschler
Also filed as: OESCHLER NIELS
7 granted patents·21 citations·filing 2011–2019
78Inventor score
Top patents by PatentIndex Score
7 records- 0181US8466548B2Semiconductor device including excess solderBAYERER REINHOLD·Filed 2011·Granted Jun 18, 2013·7 cites·25 claims
- 0280US8835299B2Pre-sintered semiconductor die structureSPECKELS ROLAND·Filed 2012·Granted Sep 16, 2014·10 cites·20 claims
- 0368US8736052B2Semiconductor device including diffusion soldered layer on sintered silver layerOESCHLER NIELS·Filed 2011·Granted May 27, 2014·4 cites·22 claims
- 0454US10600658B2Apparatus and method for bending a substrateINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 24, 2020·0 cites·20 claims
- 0545US10475668B2Apparatus and method for processing a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 12, 2019·0 cites·14 claims
- 0641US9741639B2Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrierINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 22, 2017·0 cites·13 claims
- 0739US10020278B2Method for positioning a semiconductor chip on a carrier and method for material-fit bonding of a semiconductor chip to a carrierINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 10, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →