Inventor · disambiguated record
Niranjan Pingle
Also filed as: PINGLE NIRANJAN
2 granted patents·0 citations·filing 2021–2024
29Inventor score
Technology areasH10W
Files withAPPLIED MATERIALS INC2
Top patents by PatentIndex Score
2 records- 0175US12476120B2Modular mainframe layout for supporting multiple semiconductor process modules or chambersAPPLIED MATERIALS INC·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0265US11935771B2Modular mainframe layout for supporting multiple semiconductor process modules or chambersAPPLIED MATERIALS INC·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →