Inventor · disambiguated record
Nobutoshi Fujii
Also filed as: FUJII NOBUTOSHI
75 granted patents·26 pending applications·453 citations·filing 2003–2025
99Inventor score
Top patents by PatentIndex Score
101 records- 0198US9799587B2Semiconductor deviceFUJII NOBUTOSHI·Filed 2012·Granted Oct 24, 2017·241 cites·21 claims
- 0297US11594563B2Image sensor having improved dicing propertiesSONY CORP·Filed 2021·Granted Feb 28, 2023·3 cites·16 claims
- 0396US8896125B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusKAGAWA YOSHIHISA·Filed 2012·Granted Nov 25, 2014·26 cites·36 claims
- 0495US10431621B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2018·Granted Oct 1, 2019·7 cites·26 claims
- 0595US9147650B2Semiconductor device, method for manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2013·Granted Sep 29, 2015·16 cites·16 claims
- 0694US10236238B2Semiconductor deviceSONY CORP·Filed 2017·Granted Mar 19, 2019·8 cites·20 claims
- 0794US9443802B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2015·Granted Sep 13, 2016·7 cites·24 claims
- 0894US8946797B2Solid-state imaging device, method of manufacturing solid-state imaging device, apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and electronic deviceSONY CORP·Filed 2013·Granted Feb 3, 2015·20 cites·8 claims
- 0993US9991301B2Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the sameSONY CORP·Filed 2015·Granted Jun 5, 2018·8 cites·20 claims
- 1093US9111763B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 18, 2015·9 cites·17 claims
- 1192US10485293B2Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereofSONY CORP·Filed 2017·Granted Nov 26, 2019·6 cites·20 claims
- 1292US10038021B2Packaged image sensor having improved dicing propertiesSONY CORP·Filed 2017·Granted Jul 31, 2018·6 cites·14 claims
- 1391US10026769B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2014·Granted Jul 17, 2018·12 cites·14 claims
- 1490US10608028B2Image sensor having improved dicing propertiesSONY CORP·Filed 2018·Granted Mar 31, 2020·4 cites·15 claims
- 1589US11031431B2Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jun 8, 2021·5 cites·14 claims
- 1689US11024658B2Image sensor including groovesSONY CORP·Filed 2020·Granted Jun 1, 2021·2 cites·20 claims
- 1787US10038024B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Jul 31, 2018·3 cites·15 claims
- 1887US9190275B2Bonding substrates with electrical connection through insulating filmSONY CORP·Filed 2014·Granted Nov 17, 2015·5 cites·18 claims
- 1986US10985102B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2019·Granted Apr 20, 2021·2 cites·17 claims
- 2085US11194135B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 7, 2021·2 cites·8 claims
- 2184US10217791B2Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and cameraSONY CORP·Filed 2016·Granted Feb 26, 2019·3 cites·17 claims
- 2283US11130299B2Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Sep 28, 2021·2 cites·8 claims
- 2383US10753551B2Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrateSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 25, 2020·4 cites·5 claims
- 2483US9911778B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Mar 6, 2018·2 cites·12 claims
- 2582US11923279B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Mar 5, 2024·0 cites·9 claims
- 2681US10379323B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 13, 2019·1 cites·21 claims
- 2781US9666627B2Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating filmSONY CORP·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 2880US11742374B2Semiconductor device, method of manufacturing semiconductor device, and imaging elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Aug 29, 2023·2 cites·10 claims
- 2980US10431618B2Stacked lens structure method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2016·Granted Oct 1, 2019·1 cites·38 claims
- 3079US11543621B2AF module, camera module, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 3, 2023·2 cites·10 claims
- 3178US11626356B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Apr 11, 2023·0 cites·24 claims
- 3278US11569123B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2021·Granted Jan 31, 2023·0 cites·17 claims
- 3378US11525984B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·14 claims
- 3478US9716076B2Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereofSONY CORP·Filed 2015·Granted Jul 25, 2017·2 cites·17 claims
- 3578US9530687B2Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and cameraSONY CORP·Filed 2014·Granted Dec 27, 2016·3 cites·19 claims
- 3678US7585789B2Method for forming porous insulation filmASM JAPAN·Filed 2006·Granted Sep 8, 2009·6 cites·17 claims
- 3777US11107855B2Method for bonding and connecting substratesSONY CORP·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 3876US10707258B2Semiconductor device with multiple substrates electrically connected through an insulating filmSONY CORP·Filed 2018·Granted Jul 7, 2020·1 cites·19 claims
- 3975US10991745B2Semiconductor device, method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Apr 27, 2021·2 cites·19 claims
- 4075US10134795B2Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing methodSONY CORP·Filed 2017·Granted Nov 20, 2018·1 cites·7 claims
- 4175US8642444B2Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and cameraFUJII NOBUTOSHI·Filed 2010·Granted Feb 4, 2014·3 cites·16 claims
- 4275US2021366958A1Semiconductor device and manufacturing methodSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 4374US10818717B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 4474US9276043B2Photoelectric conversion device, method of manufacturing photoelectric conversion device, solid-state imaging unit, and electronic apparatusSONY CORP·Filed 2013·Granted Mar 1, 2016·3 cites·11 claims
- 4574US2025098351A1Solid-state imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 4673US7727907B2Manufacturing method of semiconductor device and semiconductor device produced therewithULVAC INC·Filed 2005·Granted Jun 1, 2010·5 cites·15 claims
- 4772US12199123B2Semiconductor device including a structure for higher integrationSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Jan 14, 2025·0 cites·10 claims
- 4871US2025267971A1Imaging device, electronic device, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 4970US11990366B2Semiconductor device and method for manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted May 21, 2024·0 cites·13 claims
- 5070US11342371B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2020·Granted May 24, 2022·0 cites·17 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →