Inventor · disambiguated record
Nobuyuki Fukushi
Also filed as: FUKUSHI NOBUYUKI
10 granted patents·3 pending applications·4 citations·filing 2014–2025
77Inventor score
Top patents by PatentIndex Score
13 records- 0172US10283387B2Peeling apparatusDISCO CORP·Filed 2017·Granted May 7, 2019·2 cites·1 claims
- 0265US9360773B2Mark detecting methodDISCO CORP·Filed 2014·Granted Jun 7, 2016·2 cites·3 claims
- 0360US11667003B2Processing apparatusDISCO CORP·Filed 2021·Granted Jun 6, 2023·0 cites·1 claims
- 0457US11577363B2Grinding method of bonded workpiece obtained by bonding transparent components or semitransparent components to each otherDISCO CORP·Filed 2021·Granted Feb 14, 2023·0 cites·5 claims
- 0554US2023178359A1Wafer manufacturing method and grinding apparatusDISCO CORP·Filed 2022·Application pending·0 cites
- 0653US11389927B2Processing apparatusDISCO CORP·Filed 2019·Granted Jul 19, 2022·0 cites·14 claims
- 0752US12394658B2Method of processing plate-shaped workpieceDISCO CORP·Filed 2022·Granted Aug 19, 2025·0 cites·12 claims
- 0847US2025282019A1Processing apparatus and wafer processing methodDISCO CORORATION·Filed 2025·Application pending·0 cites
- 0945US11945074B2Processing apparatusDISCO CORP·Filed 2021·Granted Apr 2, 2024·0 cites·6 claims
- 1045US11731239B2Processing apparatusDISCO CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 1143US11810807B2Processing apparatus configured for processing wafers continuously under different processing conditionsDISCO CORP·Filed 2021·Granted Nov 7, 2023·0 cites·10 claims
- 1238US10896830B2Separating apparatusDISCO CORP·Filed 2019·Granted Jan 19, 2021·0 cites·2 claims
- 1337US2020262029A1Grinding apparatusDISCO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →