Inventor · disambiguated record
Nobuo Kamehara
Also filed as: KAMEHARA NOBUO · MURAKAWA KYOHEI
35 granted patents·1,025 citations·filing 1978–2000
98Inventor score
Files withFUJITSU LTD35
Top patents by PatentIndex Score
35 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0286US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0382US6193905B1Immersion cooling coolantFUJITSU LTD·Filed 1995·Granted Feb 27, 2001·60 cites·6 claims
- 0480US4313026AMultilayer circuit boardsFUJITSU LTD·Filed 1979·Granted Jan 26, 1982·40 cites·13 claims
- 0579US5349499AImmersion cooling coolant and electronic device using this coolantFUJITSU LTD·Filed 1993·Granted Sep 20, 1994·53 cites·9 claims
- 0679US4642148AMethod for producing a multilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Feb 10, 1987·49 cites·7 claims
- 0778US5906481APiezoelectric fluid pumpFUJITSU LTD·Filed 1996·Granted May 25, 1999·41 cites·18 claims
- 0877US4954480AMulti-layer superconducting circuit substrate and process for manufacturing sameFUJITSU LTD·Filed 1988·Granted Sep 4, 1990·49 cites·4 claims
- 0976US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 1074US4504339AMethod for producing multilayered glass-ceramic structure with copper-based conductors thereinFUJITSU LTD·Filed 1983·Granted Mar 12, 1985·35 cites·14 claims
- 1169US5593526AProcess for preparing a multi-layer wiring boardFUJITSU LTD·Filed 1994·Granted Jan 14, 1997·36 cites·25 claims
- 1264US5659004AEpoxy resin compositionFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·31 cites·19 claims
- 1364US4217337AProcess for manufacturing an alumina substrate by acid purifying a prefired substrate before final firingFUJITSU LTD·Filed 1978·Granted Aug 12, 1980·16 cites·17 claims
- 1463US4346516AMethod of forming a ceramic circuit substrateFUJITSU LTD·Filed 1981·Granted Aug 31, 1982·24 cites·19 claims
- 1562US5287620AProcess of producing multiple-layer glass-ceramic circuit boardFUJITSU LTD·Filed 1992·Granted Feb 22, 1994·30 cites·7 claims
- 1662US5038571AProduction and use of coolant in cryogenic devicesFUJITSU LTD·Filed 1989·Granted Aug 13, 1991·25 cites·38 claims
- 1761US5458709AProcess for manufacturing multi-layer glass ceramic substrateFUJITSU LTD·Filed 1992·Granted Oct 17, 1995·29 cites·8 claims
- 1855US4761325AMultilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Aug 2, 1988·18 cites·20 claims
- 1952US5081070ASuperconducting circuit board and paste adopted thereforFUJITSU LTD·Filed 1989·Granted Jan 14, 1992·17 cites·14 claims
- 2051US6156259AMethod of manufacturing piezoelectric materialsFUJITSU LTD·Filed 1995·Granted Dec 5, 2000·11 cites·8 claims
- 2151US5443786AComposition for the formation of ceramic viasFUJITSU LTD·Filed 1990·Granted Aug 22, 1995·19 cites·7 claims
- 2247US5275889AMulti-layer wiring boardFUJITSU LTD·Filed 1991·Granted Jan 4, 1994·13 cites·9 claims
- 2347US5141917AMultilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting filmsFUJITSU LTD·Filed 1990·Granted Aug 25, 1992·7 cites·7 claims
- 2444US5015314AMethod for production of ceramic circuit boardFUJITSU LTD·Filed 1990·Granted May 14, 1991·10 cites·3 claims
- 2542US5962955APiezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the sameFUJITSU LTD·Filed 1997·Granted Oct 5, 1999·7 cites·4 claims
- 2640US5683529AProcess of producing aluminum nitride multiple-layer circuit boardFUJITSU LTD·Filed 1996·Granted Nov 4, 1997·9 cites·20 claims
- 2740US5049541AProcess for preparing superconductorFUJITSU LTD·Filed 1989·Granted Sep 17, 1991·6 cites·16 claims
- 2840US4679320AProcess for producing multilayer ceramic circuit board with copperFUJITSU LTD·Filed 1985·Granted Jul 14, 1987·11 cites·7 claims
- 2939US6097412AInk jet printer head and method for fabricating the same including a piezoelectric device with a multilayer body having a pair of high rigidity plates provided on the side wallsFUJITSU LTD·Filed 1998·Granted Aug 1, 2000·5 cites·5 claims
- 3038US5196384AMethod for preparing green sheetsFUJITSU LTD·Filed 1991·Granted Mar 23, 1993·9 cites·8 claims
- 3137US5306702AProcess for producing Bi-Pb-Sr-Ca-Cu-O superconducting filmsFUJITSU LTD·Filed 1991·Granted Apr 26, 1994·5 cites·12 claims
- 3233US5585332AProcess for preparing a perovskite Bi-containing superconductor filmFUJITSU LTD·Filed 1995·Granted Dec 17, 1996·3 cites·7 claims
- 3333US5286713AMethod for manufacturing an oxide superconducting circuit board by printingFUJITSU LTD·Filed 1993·Granted Feb 15, 1994·5 cites·24 claims
- 3432US5629269AProcess for forming oxide superconducting films with a plurality of metal buffer layersFUJITSU LTD·Filed 1994·Granted May 13, 1997·2 cites·20 claims
- 3530US5312803AProcess for producing Bi- and Pb-containing oxide superconducting wiring filmsFUJITSU LTD·Filed 1991·Granted May 17, 1994·1 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →