Inventor · disambiguated record
Nobuyasu Kitahara
Also filed as: KITAHARA NOBUYASU
13 granted patents·11 pending applications·198 citations·filing 2004–2025
89Inventor score
Top patents by PatentIndex Score
24 records- 0196US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 0291US7915140B2Fabrication method for device having die attach film on the back side thereofDISCO CORP·Filed 2009·Granted Mar 29, 2011·22 cites·1 claims
- 0390US7446022B2Wafer laser processing methodDISCO CORP·Filed 2006·Granted Nov 4, 2008·15 cites·3 claims
- 0487US7696014B2Method for breaking adhesive film mounted on back of waferDISCO CORP·Filed 2009·Granted Apr 13, 2010·12 cites·5 claims
- 0571US9090783B2Protective film agent for laser dicing and wafer processing method using the protective film agentTAKANASHI HIROSHI·Filed 2010·Granted Jul 28, 2015·3 cites·5 claims
- 0670US9700961B2Ablation method for die attach filmDISCO CORP·Filed 2012·Granted Jul 11, 2017·3 cites·8 claims
- 0770US7396780B2Method for laser processing of waferDISCO CORP·Filed 2005·Granted Jul 8, 2008·4 cites·1 claims
- 0862US9054179B2Wafer processing methodDISCO CORP·Filed 2014·Granted Jun 9, 2015·1 cites·5 claims
- 0957US2024079261A1Method of manufacturing laminated device chipsDISCO CORP·Filed 2023·Application pending·0 cites
- 1053US2025285872A1Processing methodDISCO CORP·Filed 2025·Application pending·0 cites
- 1152US11892282B2Protective film thickness measuring methodDISCO CORP·Filed 2022·Granted Feb 6, 2024·0 cites·11 claims
- 1250US2022399235A1Manufacturing method for device chipDISCO CORP·Filed 2022·Application pending·0 cites
- 1348US2006105544A1Protective film agent for laser dicing and wafer processing method using the protective film agentDISCO CORP·Filed 2005·Application pending·0 cites
- 1447US2023041754A1Processing apparatus and vibration detecting methodDISCO CORP·Filed 2022·Application pending·0 cites
- 1546US11133186B2Processing method of workpieceDISCO CORP·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 1643US2010129546A1Protective film forming method and apparatusDISCO CORP·Filed 2009·Application pending·0 cites
- 1742US7799700B2Method for applying resin film to face of semiconductor waferDISCO CORP·Filed 2006·Granted Sep 21, 2010·0 cites·4 claims
- 1842US2014206177A1Wafer processing methodDISCO CORP·Filed 2014·Application pending·0 cites
- 1942US2014175070A1Laser processing method and fine particle layer forming agentDISCO CORP·Filed 2013·Application pending·0 cites
- 2041US2006035411A1Laser processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 2140US2013087948A1Ablation method for substrate on which passivation film is formedDISCO CORP·Filed 2012·Application pending·0 cites
- 2239US10201936B2Jig and processing method using jigDISCO CORP·Filed 2017·Granted Feb 12, 2019·0 cites·4 claims
- 2338US2013087947A1Ablation methodDISCO CORP·Filed 2012·Application pending·0 cites
- 2432US8461025B2Protective film forming method and apparatusKITAHARA NOBUYASU·Filed 2010·Granted Jun 11, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →