Inventor · disambiguated record
Norifumi Kohama
Also filed as: KOHAMA NORIFUMI
5 granted patents·6 pending applications·0 citations·filing 2018–2025
59Inventor score
Files withTOKYO ELECTRON LTD11
Top patents by PatentIndex Score
11 records- 0165US2023014665A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0258US2024395573A1Bonding method and bonding systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0355US2024282617A1Substrate processing apparatus and substrate placing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0454US11482431B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 25, 2022·0 cites·11 claims
- 0554US2024105497A1Substrate processing apparatus and holding method of substrateTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0653US2025293065A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0752US2024274462A1Substrate processing apparatus and substrate placing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0849US12322599B2Substrate processing method, modification device and substrate processing systemTOKYO ELECTRON LTD·Filed 2019·Granted Jun 3, 2025·0 cites·5 claims
- 0949US11574808B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Feb 7, 2023·0 cites·9 claims
- 1041US10964563B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2018·Granted Mar 30, 2021·0 cites·10 claims
- 1135US11721596B2Parameter adjustment method of bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2019·Granted Aug 8, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →