Inventor · disambiguated record
Nobuhito Makino
Also filed as: MAKINO NOBUHITO
15 granted patents·5 pending applications·34 citations·filing 1993–2017
89Inventor score
Files withNIPPON MINING CO5NAGATA KENICHI4MAKINO NOBUHITO3JX NIPPON MINING & METALS CORP2KOHIKI MICHIYA2
Top patents by PatentIndex Score
20 records- 0189US9090970B2High-purity copper-manganese-alloy sputtering targetNAGATA KENICHI·Filed 2012·Granted Jul 28, 2015·5 cites·7 claims
- 0282US7670434B2Vapor phase growth apparatusNIPPON MINING CO·Filed 2005·Granted Mar 2, 2010·5 cites·6 claims
- 0381US9068258B2Titanium target for sputteringTSUKAMOTO SHIRO·Filed 2011·Granted Jun 30, 2015·2 cites·13 claims
- 0480US9165750B2High purity copper—manganese alloy sputtering targetJX NIPPON MINING & METALS CORP·Filed 2013·Granted Oct 20, 2015·5 cites·11 claims
- 0575US9704695B2Sputtering target and manufacturing method thereforNAGATA KENICHI·Filed 2012·Granted Jul 11, 2017·3 cites·4 claims
- 0661US9530628B2Titanium target for sputteringMAKINO NOBUHITO·Filed 2012·Granted Dec 27, 2016·1 cites·16 claims
- 0758US10557195B2Sputtering target and/or coil, and process for producing sameJX NIPPON MINING & METALS CORP·Filed 2017·Granted Feb 11, 2020·0 cites·5 claims
- 0855US8721864B2Process and apparatus for producing a metal covered polyimide compositeKOHIKI MICHIYA·Filed 2012·Granted May 13, 2014·0 cites·9 claims
- 0953US7344597B2Vapor-phase growth apparatusNIPPON MINING CO·Filed 2002·Granted Mar 18, 2008·2 cites·4 claims
- 1053US7314519B2Vapor-phase epitaxial apparatus and vapor phase epitaxial methodNIPPON MINING CO·Filed 2002·Granted Jan 1, 2008·2 cites·16 claims
- 1153US2010323215A1Non-Adhesive-Type Flexible Laminate and Method for Production ThereofNIPPON MINING CO·Filed 2008·Application pending·0 cites
- 1252US9951412B2Sputtering target and/or coil, and process for producing sameNAGATA KENICHI·Filed 2011·Granted Apr 24, 2018·0 cites·8 claims
- 1352US8568899B2Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit boardKOHIKI MICHIYA·Filed 2008·Granted Oct 29, 2013·1 cites·18 claims
- 1451US8487191B2Flexible laminate and flexible electronic circuit board formed by using the sameMAKINO NOBUHITO·Filed 2009·Granted Jul 16, 2013·1 cites·8 claims
- 1550US9666418B2Titanium target for sputteringTSUKAMOTO SHIRO·Filed 2012·Granted May 30, 2017·0 cites·17 claims
- 1650US2014158532A1High-purity copper-manganese-alloy sputtering targetNAGATA KENICHI·Filed 2012·Application pending·0 cites
- 1749US2012135160A1Method for Production of Non-Adhesive-Type Flexible LaminateMAKINO NOBUHITO·Filed 2012·Application pending·0 cites
- 1848US2010215982A1Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the CompositeNIPPON MINING AND METALS CO LT·Filed 2008·Application pending·0 cites
- 1941US2011003169A1Non-Adhesive Flexible LaminateNIPPON MINING CO·Filed 2008·Application pending·0 cites
- 2034US5434100ASubstrate for epitaxy and epitaxy using the substrateJAPAN ENERGY CORP·Filed 1993·Granted Jul 18, 1995·7 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →