Inventor · disambiguated record
Nobuto Managaki
Also filed as: MANAGAKI NOBUTO
16 granted patents·13 pending applications·20 citations·filing 2014–2025
88Inventor score
Top patents by PatentIndex Score
29 records- 0192US10896945B2Display device including concave/convex structure in the inorganic insulation layerJAPAN DISPLAY INC·Filed 2018·Granted Jan 19, 2021·9 cites·11 claims
- 0289US10923558B2Display device and method of manufacturing display deviceJAPAN DISPLAY INC·Filed 2020·Granted Feb 16, 2021·3 cites·8 claims
- 0385US2025063913A1Display deviceJAPAN DISPLAY INC·Filed 2024·Application pending·0 cites
- 0482US11342406B2Display device including concave/convex structure in the inorganic insulation layerJAPAN DISPLAY INC·Filed 2020·Granted May 24, 2022·1 cites·6 claims
- 0582US9548279B2Connection member, semiconductor device, and stacked structureTOSHIBA KK·Filed 2014·Granted Jan 17, 2017·5 cites·6 claims
- 0681US12167659B2Display device comprising sealing film including stacked insulating layersJAPAN DISPLAY INC·Filed 2023·Granted Dec 10, 2024·0 cites·15 claims
- 0775US11778879B2Display device including concave/convex structure in the inorganic insulation layerJAPAN DISPLAY INC·Filed 2022·Granted Oct 3, 2023·0 cites·16 claims
- 0866US12396320B2Display deviceMAGNOLIA WHITE CORP·Filed 2022·Granted Aug 19, 2025·0 cites·6 claims
- 0964US2025359459A1Display deviceJAPAN DISPLAY INC·Filed 2025·Application pending·0 cites
- 1063US2025160197A1Light-emitting element and display deviceJAPAN DISPLAY INC·Filed 2024·Application pending·0 cites
- 1163US2025126961A1Light-emitting element and display device having the light-emitting elementJAPAN DISPLAY INC·Filed 2024·Application pending·0 cites
- 1263US2025126969A1Light-emitting element and display device having the light-emitting elementJAPAN DISPLAY INC·Filed 2024·Application pending·0 cites
- 1362US2025048880A1Display device and manufacturing method thereofJAPAN DISPLAY INC·Filed 2024·Application pending·0 cites
- 1461US9502367B2Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the capTOSHIBA KK·Filed 2015·Granted Nov 22, 2016·1 cites·9 claims
- 1560US9576925B2Semiconductor device having a cylindrical shaped conductive portionTOSHIBA KK·Filed 2015·Granted Feb 21, 2017·1 cites·10 claims
- 1660US2024215294A1Display device and method of manufacturing the sameJAPAN DISPLAY INC·Filed 2023·Application pending·0 cites
- 1759US11690279B2Semiconductor device and manufacturing method thereofJAPAN DISPLAY INC·Filed 2021·Granted Jun 27, 2023·0 cites·15 claims
- 1859US2024215279A1Display deviceJAPAN DISPLAY INC·Filed 2023·Application pending·0 cites
- 1959US2024215293A1Display device and method of manufacturing the sameJAPAN DISPLAY INC·Filed 2023·Application pending·0 cites
- 2059US2024215278A1Display device and method of manufacturing the sameJAPAN DISPLAY INC·Filed 2023·Application pending·0 cites
- 2158US9913367B2Wiring board and method of manufacturing the sameTOSHIBA KK·Filed 2014·Granted Mar 6, 2018·0 cites·15 claims
- 2252US11145705B2Display device and method for manufacturing the sameJAPAN DISPLAY INC·Filed 2020·Granted Oct 12, 2021·0 cites·13 claims
- 2351US11211580B2Display device and method for manufacturing the sameJAPAN DISPLAY INC·Filed 2020·Granted Dec 28, 2021·0 cites·14 claims
- 2450US10553657B2Light-emitting element and display deviceJAPAN DISPLAY INC·Filed 2018·Granted Feb 4, 2020·0 cites·18 claims
- 2547US9698482B2Antenna deviceTOSHIBA KK·Filed 2014·Granted Jul 4, 2017·0 cites·10 claims
- 2647US2017148713A1Connection member, semiconductor device, and stacked structureTOSHIBA KK·Filed 2016·Application pending·0 cites
- 2744US2015021748A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2836US9397057B2Plurality of semiconductor devices in resin with a viaTOSHIBA KK·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 2933US2015348937A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →