Inventor · disambiguated record
Nobuaki Miyamoto
Also filed as: MIYAMOTO NOBUAKI
18 granted patents·3 pending applications·137 citations·filing 1982–2019
93Inventor score
Files withJX NIPPON MINING & METALS CORP10HITACHI CABLE5CHINDA AKIRA2MIYAMOTO NOBUAKI1NEC ELECTRONICS CORP1
Top patents by PatentIndex Score
21 records- 0192US7939935B2Electronic device substrate, electronic device and methods for fabricating the sameHITACHI CABLE·Filed 2007·Granted May 10, 2011·25 cites·24 claims
- 0290US9955583B2Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2014·Granted Apr 24, 2018·10 cites·11 claims
- 0387US7880091B2Electronic device substrate, electronic device and methods for making sameHITACHI CABLE·Filed 2006·Granted Feb 1, 2011·13 cites·4 claims
- 0485US8101864B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodCHINDA AKIRA·Filed 2009·Granted Jan 24, 2012·13 cites·7 claims
- 0584US7681310B2Method for fabricating double-sided wiring boardHITACHI CABLE·Filed 2005·Granted Mar 23, 2010·12 cites·9 claims
- 0682US10299385B2Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted May 21, 2019·1 cites·43 claims
- 0782US4402931AProcess for producing manganese dioxideTANABE ISAO·Filed 1982·Granted Sep 6, 1983·33 cites·6 claims
- 0880US11337314B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted May 17, 2022·0 cites·20 claims
- 0980US10349531B2Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing methodJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jul 9, 2019·3 cites·18 claims
- 1079US11375624B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted Jun 28, 2022·1 cites·19 claims
- 1179US7705245B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodHITACHI CABLE·Filed 2006·Granted Apr 27, 2010·8 cites·12 claims
- 1277US11382217B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted Jul 5, 2022·0 cites·18 claims
- 1377US11337315B2Surface treated copper foil, copper clad laminate, and printed circuit boardJX NIPPON MINING & METALS CORP·Filed 2019·Granted May 17, 2022·0 cites·8 claims
- 1475US8230591B2Method for fabricating an electronic device substrateCHINDA AKIRA·Filed 2008·Granted Jul 31, 2012·6 cites·14 claims
- 1572US7780836B2Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the sameHITACHI CABLE·Filed 2006·Granted Aug 24, 2010·5 cites·8 claims
- 1671US8230588B2Method of making an electronic device and electronic device substrateMIYAMOTO NOBUAKI·Filed 2009·Granted Jul 31, 2012·5 cites·6 claims
- 1768US10356898B2Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jul 16, 2019·1 cites·36 claims
- 1868US10251283B2Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Apr 2, 2019·1 cites·23 claims
- 1959US2018279482A1Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 2047US2006225918A1Electronic device substrate and its fabrication method, and electronic device and its fabrication methodNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2146US2006275771A1Quantitative reagent, method and equipment of substance utilizing fluorescence lifetimeSUZUKI HIDEYUKI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →