Inventor · disambiguated record
Norikiyo Nakagawa
Also filed as: NAKAGAWA NORIKIYO
5 granted patents·1 pending application·0 citations·filing 2009–2022
60Inventor score
Top patents by PatentIndex Score
6 records- 0171US11971658B2Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structureASAHI CHEMICAL IND·Filed 2022·Granted Apr 30, 2024·0 cites·9 claims
- 0249US11500287B2Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structureASAHI CHEMICAL IND·Filed 2017·Granted Nov 15, 2022·0 cites·14 claims
- 0349US9139771B2Copper oxide etchant and etching method using the sameASAHI KASEI E MATERIALS CORP·Filed 2013·Granted Sep 22, 2015·0 cites·7 claims
- 0440US9257142B2Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered productMITAMURA YOSHIMICHI·Filed 2009·Granted Feb 9, 2016·0 cites·36 claims
- 0540US2013026134A1Copper oxide etchant and etching method using the sameASAHI CHEMICAL IND·Filed 2011·Application pending·0 cites
- 0630US9121101B2Etchant and etching method using the sameNAKATA TAKUTO·Filed 2012·Granted Sep 1, 2015·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →