Inventor · disambiguated record
Nobuya Nakamura
Also filed as: NAKAMURA NOBUYA
5 granted patents·3 pending applications·11 citations·filing 2003–2018
72Inventor score
Top patents by PatentIndex Score
8 records- 0177US7456247B2Phenolic resin formed from a difunctional phenol and a divinyl etherDAINIPPON INK & CHEMICALS·Filed 2006·Granted Nov 25, 2008·2 cites·2 claims
- 0275US7087702B2Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resinDAINIPPON INK & CHEMICALS·Filed 2003·Granted Aug 8, 2006·9 cites·3 claims
- 0358US7569654B2Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resinDAINIPPON INK & CHEMICALS·Filed 2006·Granted Aug 4, 2009·0 cites·8 claims
- 0458US7365147B2Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resinDAINIPPON INK & CHEMICALS·Filed 2006·Granted Apr 29, 2008·0 cites·2 claims
- 0540US2020115543A1Epoxy resin compositionDAINIPPON INK & CHEMICALS·Filed 2017·Application pending·0 cites
- 0638US9580634B2Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealantDAINIPPON INK & CHEMICALS·Filed 2013·Granted Feb 28, 2017·0 cites·18 claims
- 0737US2020087444A1Epoxy resin, production method, and epoxy resin composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2018·Application pending·0 cites
- 0832US2013184377A1Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating materialOGURA ICHIROU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →