Inventor · disambiguated record
Nobumori Ogoshi
Also filed as: OGOSHI NOBUMORI
3 granted patents·2 pending applications·4 citations·filing 2006–2023
52Inventor score
Files withDISCO CORP5
Top patents by PatentIndex Score
5 records- 0173US7544587B2Wafer dividing method and wafer dividing apparatusDISCO CORP·Filed 2007·Granted Jun 9, 2009·4 cites·5 claims
- 0247US2023219164A1Laser processing apparatusDISCO CORP·Filed 2023·Application pending·0 cites
- 0344US2006249496A1Processing method and apparatus using laser beamDISCO CORP·Filed 2006·Application pending·0 cites
- 0436US9034735B2Laser processing method for workpieceDISCO CORP·Filed 2013·Granted May 19, 2015·0 cites·9 claims
- 0531US10249547B2Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layerDISCO CORP·Filed 2016·Granted Apr 2, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →