Inventor · disambiguated record
Norikazu Ozaki
Also filed as: OZAKI NORIKAZU
28 granted patents·9 pending applications·291 citations·filing 1993–2025
96Inventor score
Top patents by PatentIndex Score
37 records- 0192US6399897B1Multi-layer wiring substrateFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·63 cites·6 claims
- 0284USD380644SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 8, 1997·28 cites·1 claims
- 0384USD371039SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 25, 1996·24 cites·1 claims
- 0483USD437179SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 6, 2001·28 cites·1 claims
- 0578USD371041SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 25, 1996·19 cites·1 claims
- 0677US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 0776US8151456B2Method of producing substrateMAEHARA YASUTOMO·Filed 2008·Granted Apr 10, 2012·9 cites·5 claims
- 0873USD353074SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Dec 6, 1994·16 cites·1 claims
- 0971US10009998B1Method of manufacturing substrate and substrateFUJITSU LTD·Filed 2017·Granted Jun 26, 2018·1 cites·20 claims
- 1071US6526654B1Method of producing double-sided circuit boardFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·20 cites·12 claims
- 1165US8035037B2Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·2 cites·10 claims
- 1264US2025365869A1Method for manufacturing multilayer substrateFICT LTD·Filed 2025·Application pending·0 cites
- 1363US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 1463US2025374420A1Laminated substrate and method of manufacturing laminated substrateFICT LTD·Filed 2025·Application pending·0 cites
- 1559US2009098391A1Core member and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1655USD436493SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 23, 2001·9 cites·1 claims
- 1755USD435389SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 26, 2000·9 cites·1 claims
- 1854US7197813B2Method of accurate evaluation on magnetoresistive read elementFUJITSU LTD·Filed 2001·Granted Apr 3, 2007·2 cites·10 claims
- 1953US6389686B2Process for fabricating a thin multi-layer circuit boardFUJITSU LTD·Filed 2000·Granted May 21, 2002·4 cites·14 claims
- 2051USD371040SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 25, 1996·6 cites·1 claims
- 2151US2010018758A1Printed wiring boardFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2251US2010018762A1Buildup printed circuit boardFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2349US2009095509A1Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2448US12114433B2Substrate, method for manufacturing substrate, and electronic deviceFUJITSU INTERCONNECT TECH LIMITED·Filed 2020·Granted Oct 8, 2024·0 cites·7 claims
- 2548US6184476B1Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zoneFUJITSU LTD·Filed 1997·Granted Feb 6, 2001·10 cites·4 claims
- 2647US8642894B2Circuit board, method of manufacturing the same, and resistance elementABE TOMOYUKI·Filed 2010·Granted Feb 4, 2014·0 cites·9 claims
- 2746US6171514B1Polishing method for planarizing a substrateFUJITSU LTD·Filed 1998·Granted Jan 9, 2001·12 cites·7 claims
- 2845US5679268AThin multi-layer circuit board and process for fabricating the sameFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·9 cites·21 claims
- 2944US2024147613A1Multilayer board and method for manufacturing multilayer boardFICT LTD·Filed 2022·Application pending·0 cites
- 3043US6465085B1Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the sameFUJITSU LTD·Filed 2000·Granted Oct 15, 2002·2 cites·20 claims
- 3143US2024064907A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2022·Application pending·0 cites
- 3240US2023180398A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2021·Application pending·0 cites
- 3339USD371042SMicrowave ovenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 25, 1996·3 cites·1 claims
- 3435USD732087SRefrigeratorPANASONIC CORP·Filed 2012·Granted Jun 16, 2015·2 cites·1 claims
- 3532USD765743SDrawer for refrigeratorPANASONIC CORP·Filed 2014·Granted Sep 6, 2016·1 cites·1 claims
- 3632USD697093SRefrigeratorPANASONIC CORP·Filed 2012·Granted Jan 7, 2014·1 cites·1 claims
- 3730US5578186AMethod for forming an acrylic resist on a substrate and a fabrication process of an electronic apparatusFUJITSU LTD·Filed 1995·Granted Nov 26, 1996·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →