Inventor · disambiguated record
Noriyoshi Shimizu
Also filed as: SHIMIZU NORIYOSHI
112 granted patents·25 pending applications·975 citations·filing 1994–2024
99Inventor score
Files withSHINKO ELECTRIC IND CO61FUJITSU LTD23FUJITSU SEMICONDUCTOR LTD11PHILTECH INC10PANASONIC IP MAN CO LTD9
Top patents by PatentIndex Score
137 records- 0198US7304384B2Semiconductor device with a barrier film which contains manganeseSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Granted Dec 4, 2007·87 cites·15 claims
- 0297US9875957B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 23, 2018·27 cites·8 claims
- 0396US7507666B2Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main compositionFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 24, 2009·49 cites·7 claims
- 0495US9859201B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 2, 2018·18 cites·9 claims
- 0594US8724978B2Fluid heating-cooling cylinder deviceFURUMURA YUJI·Filed 2012·Granted May 13, 2014·15 cites·20 claims
- 0694US8288875B2Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitchSHIMIZU NORIYOSHI·Filed 2010·Granted Oct 16, 2012·20 cites·9 claims
- 0793US9820391B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 14, 2017·11 cites·17 claims
- 0893US9520352B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 13, 2016·11 cites·9 claims
- 0993US7536780B2Method of manufacturing wiring substrate to which semiconductor chip is mountedSHINKO ELECTRIC IND CO·Filed 2005·Granted May 26, 2009·30 cites·8 claims
- 1092US8168532B2Method of manufacturing a multilayer interconnection structure in a semiconductor deviceHANEDA MASAKI·Filed 2008·Granted May 1, 2012·21 cites·13 claims
- 1192US7413977B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodFUJITSU LTD·Filed 2005·Granted Aug 19, 2008·17 cites·4 claims
- 1291US9620446B2Wiring board, electronic component device, and method for manufacturing thoseSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 11, 2017·7 cites·9 claims
- 1391US8003527B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2010·Granted Aug 23, 2011·14 cites·15 claims
- 1491US7507659B2Fabrication process of a semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Mar 24, 2009·23 cites·12 claims
- 1590US9167692B2Wiring board, semiconductor device, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 20, 2015·11 cites·12 claims
- 1689US10028393B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2015·Granted Jul 17, 2018·8 cites·7 claims
- 1789US9412687B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Aug 9, 2016·6 cites·6 claims
- 1889US6921977B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2003·Granted Jul 26, 2005·36 cites·10 claims
- 1989US6764931B2Semiconductor package, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 20, 2004·41 cites·5 claims
- 2089US6750541B2Semiconductor deviceFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·47 cites·17 claims
- 2188US10262932B2Wiring board, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Apr 16, 2019·6 cites·9 claims
- 2288US8133813B2Semiconductor device with a barrier filmKOIKE JUNICHI·Filed 2011·Granted Mar 13, 2012·5 cites·10 claims
- 2387US9000302B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 7, 2015·8 cites·10 claims
- 2487US6242808B1Semiconductor device with copper wiring and semiconductor device manufacturing methodFUJITSU LTD·Filed 1998·Granted Jun 5, 2001·87 cites·10 claims
- 2586US7994055B2Method of manufacturing semiconductor apparatus, and semiconductor apparatusFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Aug 9, 2011·14 cites·13 claims
- 2686US7943517B2Semiconductor device with a barrier filmSEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Granted May 17, 2011·9 cites·6 claims
- 2786US7414309B2Encapsulated electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 19, 2008·12 cites·6 claims
- 2886US7314780B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 1, 2008·12 cites·3 claims
- 2985US9455219B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 27, 2016·8 cites·5 claims
- 3085US9220167B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 22, 2015·5 cites·10 claims
- 3185US8823187B2Semiconductor package, semiconductor package manufacturing method and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted Sep 2, 2014·7 cites·9 claims
- 3285US7846833B2Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor deviceFUJITSU LTD·Filed 2010·Granted Dec 7, 2010·7 cites·7 claims
- 3385US7352060B2Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 1, 2008·13 cites·14 claims
- 3484US7211519B2Method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 1, 2007·12 cites·16 claims
- 3583US9564589B2Forming method and forming apparatus of carbon nanotubesFUJITSU LTD·Filed 2015·Granted Feb 7, 2017·3 cites·18 claims
- 3683US8581421B2Semiconductor package manufacturing method and semiconductor packageSHIMIZU NORIYOSHI·Filed 2011·Granted Nov 12, 2013·7 cites·17 claims
- 3782US9668341B2Wiring substrate and method of making wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted May 30, 2017·4 cites·5 claims
- 3882US9257386B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 9, 2016·6 cites·16 claims
- 3982US8071474B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodSHIMIZU NORIYOSHI·Filed 2010·Granted Dec 6, 2011·4 cites·7 claims
- 4082US7955970B2Semiconductor device manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Jun 7, 2011·8 cites·7 claims
- 4181US7795141B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Sep 14, 2010·5 cites·2 claims
- 4281US7358180B2Method of forming wiring structure and semiconductor deviceFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·22 cites·9 claims
- 4381US7173337B2Semiconductor device manufactured by the damascene process having improved stress migration resistanceFUJITSU LTD·Filed 2005·Granted Feb 6, 2007·9 cites·1 claims
- 4480US9119319B2Wiring board, semiconductor device, and method for manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Aug 25, 2015·6 cites·10 claims
- 4579US9780043B2Wiring board, semiconductor package, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Oct 3, 2017·3 cites·8 claims
- 4679US6828224B2Method of fabricating substrate utilizing an electrophoretic deposition processSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 7, 2004·23 cites·8 claims
- 4778US7284307B2Method for manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 23, 2007·6 cites·12 claims
- 4878US7229856B2Method of manufacturing electronic part packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 12, 2007·7 cites·9 claims
- 4977US7375022B2Method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted May 20, 2008·8 cites·10 claims
- 5076US7403370B2Capacitor partsSHINKO ELECTRIC IND CO·Filed 2005·Granted Jul 22, 2008·8 cites·10 claims
Showing the top 50 of 137 patent records by PatentIndex Score.
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