Inventor · disambiguated record
Nozomi Shimoishizaka
Also filed as: SHIMOISHIZAKA NOZOMI
26 granted patents·5 pending applications·495 citations·filing 1998–2022
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD16PANASONIC CORP10CONNECTEC JAPAN CORP2CONNECTEC AMERICA INC1SHIMOISHIZAKA NOZOMI1
Top patents by PatentIndex Score
31 records- 0197US7595222B2Semiconductor device and manufacturing method thereofPANASONIC CORP·Filed 2005·Granted Sep 29, 2009·65 cites·6 claims
- 0293US7279357B2Method for fabricating a chip-scale-packaging (CSP) having an inductorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Oct 9, 2007·30 cites·18 claims
- 0391US6852616B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 8, 2005·72 cites·10 claims
- 0490US6914331B2Semiconductor device having an inductor formed on a region of an insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 5, 2005·55 cites·8 claims
- 0590US6559528B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·59 cites·6 claims
- 0688US6313532B1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 6, 2001·74 cites·8 claims
- 0785US6512298B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·40 cites·14 claims
- 0882US7582968B2Wiring board with a protective film greater in heights than bumpsPANASONIC CORP·Filed 2006·Granted Sep 1, 2009·11 cites·6 claims
- 0978US7514802B2Wiring boardPANASONIC CORP·Filed 2006·Granted Apr 7, 2009·9 cites·16 claims
- 1078US7508073B2Wiring board, semiconductor device using the same, and method for manufacturing wiring boardPANASONIC CORP·Filed 2007·Granted Mar 24, 2009·8 cites·9 claims
- 1177US7382050B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jun 3, 2008·6 cites·4 claims
- 1277US6812573B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 2, 2004·18 cites·15 claims
- 1373US7442074B2Wiring board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Oct 28, 2008·6 cites·8 claims
- 1472US6784557B2Semiconductor device including a diffusion layer formed between electrode portionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·16 cites·8 claims
- 1571US7847198B2Wiring board and method for manufacturing the same, and semiconductor devicePANASONIC CORP·Filed 2007·Granted Dec 7, 2010·4 cites·13 claims
- 1670US7629687B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Dec 8, 2009·5 cites·3 claims
- 1766US7800209B2Wiring board with conductive wirings and protrusion electrodesPANASONIC CORP·Filed 2007·Granted Sep 21, 2010·3 cites·8 claims
- 1866US7800913B2Wiring board and semiconductor device using the samePANASONIC CORP·Filed 2006·Granted Sep 21, 2010·4 cites·8 claims
- 1965US7379307B2Wiring board and method for manufacturing the same, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted May 27, 2008·3 cites·8 claims
- 2052US7772697B2Semiconductor device and method for producing the samePANASONIC CORP·Filed 2008·Granted Aug 10, 2010·0 cites·3 claims
- 2151US6924173B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 2, 2005·4 cites·7 claims
- 2249US6954001B2Semiconductor device including a diffusion layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Oct 11, 2005·3 cites·18 claims
- 2347US11586175B2Tool, task management device, task management method, and task management systemCONNECTEC JAPAN CORP·Filed 2018·Granted Feb 21, 2023·0 cites·3 claims
- 2446US2009154126A1Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2008·Application pending·0 cites
- 2545US12191278B2Method for manufacturing electronic componentCONNECTEC AMERICA INC·Filed 2022·Granted Jan 7, 2025·0 cites·1 claims
- 2643US2009008771A1Semiconductor module device, method of manufacturing the same, flat panel display, and plasma display panelMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2742US2005006749A1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2841US12414712B2Information processing systemCONNECTEC JAPAN CORP·Filed 2018·Granted Sep 16, 2025·0 cites·8 claims
- 2939US2003006493A1Semiconductor device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
- 3039US2002000655A1Semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 3133US8283775B2Wiring board, semiconductor device and method for manufacturing the sameSHIMOISHIZAKA NOZOMI·Filed 2011·Granted Oct 9, 2012·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →