Inventor · disambiguated record
Noboru Shingai
Also filed as: SHINGAI NOBORU
3 granted patents·2 pending applications·144 citations·filing 1996–2013
78Inventor score
Top patents by PatentIndex Score
5 records- 0188US6239983B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1998·Granted May 29, 2001·58 cites·6 claims
- 0285US5886877ACircuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1996·Granted Mar 23, 1999·54 cites·12 claims
- 0384US6350957B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 2000·Granted Feb 26, 2002·32 cites·8 claims
- 0438US2016016318A1Suction deviceMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0534US2014111238A1Spiral probe and method of manufacturing the spiral probeSHINGAI NOBORU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →