Inventor · disambiguated record
Noriyuki Taguchi
Also filed as: ISOGAI TOKIO · TAGUCHI NORIYUKI
18 granted patents·4 pending applications·1,167 citations·filing 1978–2014
96Inventor score
Files withHITACHI CHEMICAL CO LTD7HITACHI LTD7MATSUSHITA ELECTRIC WORKS LTD3FUJIEDA TADASHI1PANASONIC ELEC WORKS CO LTD1
Top patents by PatentIndex Score
22 records- 0198US5976912AFabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 2, 1999·519 cites·4 claims
- 0296US6818821B2Electromagnetic wave absorption material and an associated deviceHITACHI LTD·Filed 2002·Granted Nov 16, 2004·92 cites·23 claims
- 0395US7543546B2Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing methodMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 9, 2009·76 cites·20 claims
- 0494US7187072B2Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2003·Granted Mar 6, 2007·52 cites·9 claims
- 0594US6465964B1Plasma treatment apparatus and plasma generation method using the apparatusMATSUSHITA ELECTRIC WORKS LTD·Filed 2000·Granted Oct 15, 2002·87 cites·9 claims
- 0691US6365432B1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 2, 2002·41 cites·4 claims
- 0791US5166824ARear projection screen and manufacturing method therefor as well as molding die for shaping rear projection screen, overhead projector and projection television setHITACHI LTD·Filed 1991·Granted Nov 24, 1992·41 cites·14 claims
- 0887US7239261B2Electromagnetic wave absorption material and an associated deviceHITACHI LTD·Filed 2004·Granted Jul 3, 2007·51 cites·5 claims
- 0987US6746897B2Fabrication process of semiconductor package and semiconductor packageFiled 2001·Granted Jun 8, 2004·27 cites·14 claims
- 1087US4464420ACeramic multilayer circuit board and a process for manufacturing the sameHITACHI LTD·Filed 1982·Granted Aug 7, 1984·56 cites·9 claims
- 1187US4220547ADielectric paste for thick film capacitorHITACHI LTD·Filed 1978·Granted Sep 2, 1980·32 cites·1 claims
- 1279US6670766B2Plasma treatment apparatus and plasma treatment methodMATSUSHITA ELECTRIC WORKS LTD·Filed 2001·Granted Dec 30, 2003·16 cites·26 claims
- 1378US4465727ACeramic wiring boardsHITACHI LTD·Filed 1982·Granted Aug 14, 1984·46 cites·14 claims
- 1474US9190591B2Ultraviolet irradiation head and ultraviolet irradiatorPANASONIC IND DEVICES SUNX CO·Filed 2014·Granted Nov 17, 2015·5 cites·3 claims
- 1573US6743500B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 1, 2004·9 cites·17 claims
- 1667US6641792B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2002·Granted Nov 4, 2003·5 cites·28 claims
- 1766US7273652B2Hollow carbon fiber and production methodHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 25, 2007·5 cites·31 claims
- 1850US4308571ALow temperature-sinterable dielectric composition and thick film capacitor using the sameHITACHI LTD·Filed 1980·Granted Dec 29, 1981·7 cites·5 claims
- 1943US2010147464A1Plasma treatment apparatusPANASONIC ELEC WORKS CO LTD·Filed 2008·Application pending·0 cites
- 2041US2002094606A1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 2138US2004146452A1Electromagnetic wave absorption material and an associated deviceFUJIEDA TADASHI·Filed 2004·Application pending·0 cites
- 2237US2005016456A1Plasma processing device and plasma processing methodFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →