Inventor · disambiguated record
Nobuya Takahashi
Also filed as: TAKAHASHI NOBUYA
17 granted patents·4 pending applications·81 citations·filing 1991–2023
91Inventor score
Top patents by PatentIndex Score
21 records- 0184US10840010B2Coil componentTDK CORP·Filed 2018·Granted Nov 17, 2020·2 cites·19 claims
- 0282US9711439B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·17 claims
- 0382US8698303B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceFURUTANI TOSHIKI·Filed 2011·Granted Apr 15, 2014·6 cites·7 claims
- 0477US9536801B2Electronic component having encapsulated wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 3, 2017·2 cites·20 claims
- 0576US11476041B2Coil component and manufacturing method thereforTDK CORP·Filed 2019·Granted Oct 18, 2022·1 cites·18 claims
- 0675US9035463B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted May 19, 2015·4 cites·16 claims
- 0773US5116552AProcess for preparation of dried collagen spongeGUNZE KK·Filed 1991·Granted May 26, 1992·28 cites·5 claims
- 0870US9059187B2Electronic component having encapsulated wiring board and method for manufacturing the sameFURUTANI TOSHIKI·Filed 2011·Granted Jun 16, 2015·2 cites·20 claims
- 0965US12340937B2Coil component and manufacturing method thereforTDK CORP·Filed 2020·Granted Jun 24, 2025·0 cites·8 claims
- 1064US2024153696A1Coil component and method of manufacturing coil componentTDK CORP·Filed 2023·Application pending·0 cites
- 1160US2023126614A1Coil component and manufacturing method thereforTDK CORP·Filed 2022·Application pending·0 cites
- 1255US9338886B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted May 10, 2016·0 cites·20 claims
- 1355US2023352233A1Coil component and manufacturing method thereforTDK CORP·Filed 2021·Application pending·0 cites
- 1454US8785255B2Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor deviceIBIDEN CO LTD·Filed 2014·Granted Jul 22, 2014·0 cites·7 claims
- 1550US12051531B2Coil component and its manufacturing methodTDK CORP·Filed 2019·Granted Jul 30, 2024·0 cites·8 claims
- 1645US9480157B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 1741US9736945B2Printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·20 claims
- 1840US5275602ABone-joining articlesGUNZE KK·Filed 1992·Granted Jan 4, 1994·31 cites·2 claims
- 1936US8546922B2Wiring boardFURUTANI TOSHIKI·Filed 2011·Granted Oct 1, 2013·0 cites·20 claims
- 2034US2015245485A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 2129US5722075AOverlapping cell mobile communications systemNEC CORP·Filed 1995·Granted Feb 24, 1998·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →