Inventor · disambiguated record
Nobutake Tsuyuno
Also filed as: TSUYUNO NOBUTAKE
39 granted patents·9 pending applications·253 citations·filing 1997–2023
97Inventor score
Files withHITACHI AUTOMOTIVE SYSTEMS LTD13HITACHI ASTEMO LTD11HITACHI LTD11RENESAS TECH CORP3HITACHI AUTOMOTIVE SYSTEMS HANSHIN LTD2
Top patents by PatentIndex Score
48 records- 0191US8952525B2Semiconductor module and method for manufacturing semiconductor moduleIDE EIICHI·Filed 2011·Granted Feb 10, 2015·23 cites·8 claims
- 0289US12101915B2Power module, power conversion device, and method for manufacturing power moduleHITACHI ASTEMO LTD·Filed 2020·Granted Sep 24, 2024·2 cites·19 claims
- 0389US8653652B2Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor moduleTOKUYAMA TAKESHI·Filed 2010·Granted Feb 18, 2014·12 cites·20 claims
- 0488US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 0587US8050037B2Electronic control device using LC module structureHITACHI LTD·Filed 2008·Granted Nov 1, 2011·15 cites·14 claims
- 0684US7899602B2Engine control unitHITACHI LTD·Filed 2008·Granted Mar 1, 2011·13 cites·9 claims
- 0780US7679182B2Power module and motor integrated control unitHITACHI LTD·Filed 2007·Granted Mar 16, 2010·9 cites·16 claims
- 0877US9852962B2Waterproof electronic device and manufacturing method thereofHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Dec 26, 2017·3 cites·10 claims
- 0977US6097100AResin sealed semiconductor devices and a process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 1, 2000·56 cites·16 claims
- 1076US9497873B2Power module including first and second sealing resinsHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2013·Granted Nov 15, 2016·4 cites·10 claims
- 1174US10763190B2Power semiconductor module, power conversion device using same, and method for manufacturing power conversion deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Sep 1, 2020·2 cites·14 claims
- 1274US9373558B2Resin-sealed electronic control deviceHITACHI LTD·Filed 2013·Granted Jun 21, 2016·3 cites·20 claims
- 1373US10818573B2Power semiconductor module with heat dissipation plateHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Oct 27, 2020·2 cites·11 claims
- 1471US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 1569US11961780B2Semiconductor module, power conversion device, and manufacturing method of semiconductor moduleHITACHI ASTEMO LTD·Filed 2019·Granted Apr 16, 2024·1 cites·10 claims
- 1669US11469160B2Power module with active elements and intermediate electrode that connects conductorsHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2019·Granted Oct 11, 2022·1 cites·7 claims
- 1768US11367670B2Power semiconductor device and manufacturing method of the sameHITACHI ASTEMO LTD·Filed 2018·Granted Jun 21, 2022·1 cites·6 claims
- 1867US8723306B2Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing methodTSUYUNO NOBUTAKE·Filed 2011·Granted May 13, 2014·3 cites·14 claims
- 1964US11367671B2Power semiconductor deviceHITACHI ASTEMO LTD·Filed 2018·Granted Jun 21, 2022·1 cites·3 claims
- 2064US9326425B2Power moduleSUWA TOKIHITO·Filed 2011·Granted Apr 26, 2016·2 cites·12 claims
- 2163US10194563B2Power conversion deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Jan 29, 2019·1 cites·11 claims
- 2262US10068880B2Power moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Sep 4, 2018·1 cites·14 claims
- 2361US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 2460US10128164B2Electronic device and method of manufacturing the electronic deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Nov 13, 2018·1 cites·15 claims
- 2560US9591789B2Power semiconductor module and power moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2012·Granted Mar 7, 2017·1 cites·11 claims
- 2659US8847374B2Power semiconductor module and manufacturing method thereofIDE EIICHI·Filed 2011·Granted Sep 30, 2014·1 cites·3 claims
- 2758US12469755B2Power module and power conversion device using the sameHITACHI LTD·Filed 2021·Granted Nov 11, 2025·0 cites·10 claims
- 2855US2025105110A1Semiconductor device and power conversion deviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 2955US2025006566A1Semiconductor module, power conversion device, and method for manufacturing semiconductor moduleHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 3054US6888230B1Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 1999·Granted May 3, 2005·16 cites·20 claims
- 3153US12095382B2Semiconductor device, electric power conversion device, and manufacturing method of semiconductor deviceHITACHI LTD·Filed 2020·Granted Sep 17, 2024·0 cites·9 claims
- 3253US2025391736A1Electric Circuit Body and Power Conversion DeviceHITACHI ASTEMO LTD·Filed 2023·Application pending·0 cites
- 3352US2024243032A1Electric Circuit Body and Power Conversion DeviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 3450US12506133B2Electric circuit body, power conversion device, and method for manufacturing electric circuit bodyHITACHI ASTEMO LTD·Filed 2020·Granted Dec 23, 2025·0 cites·12 claims
- 3550US7217992B2Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 15, 2007·3 cites·12 claims
- 3650US2024038611A1Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing MethodHITACHI ASTEMO LTD·Filed 2021·Application pending·0 cites
- 3749US12506046B2Electric circuit body, power converter, and method for manufacturing electric circuit bodyHITACHI ASTEMO LTD·Filed 2020·Granted Dec 23, 2025·0 cites·9 claims
- 3847US7298039B2Electronic circuit deviceHITACHI LTD·Filed 2004·Granted Nov 20, 2007·2 cites·13 claims
- 3946US10699917B2Resin-sealed vehicle-mounted control deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2017·Granted Jun 30, 2020·0 cites·9 claims
- 4044US10190563B2Internal combustion engine ignition coil and method for manufacturing internal combustion engine ignition coilHITACHI AUTOMOTIVE SYSTEMS HANSHIN LTD·Filed 2017·Granted Jan 29, 2019·0 cites·6 claims
- 4143US10186473B2Power moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Jan 22, 2019·0 cites·7 claims
- 4243US2018190425A1Ignition Coil for Internal Combustion EngineHITACHI AUTOMOTIVE SYSTEMS HANSHIN LTD·Filed 2017·Application pending·0 cites
- 4342US11232994B2Power semiconductor device having a distance regulation portion and power conversion apparatus including the sameHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2018·Granted Jan 25, 2022·0 cites·9 claims
- 4442US8339795B2Transmission control apparatus and mechanically and electrically integrated type electronic control apparatusTSUYUNO NOBUTAKE·Filed 2010·Granted Dec 25, 2012·0 cites·9 claims
- 4540US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 4638US2004212965A1Electronic circuit apparatus and method of manufacturing the sameFiled 2004·Application pending·0 cites
- 4735US10177084B2Semiconductor module and method of manufacturing semiconductor moduleHITACHI LTD·Filed 2015·Granted Jan 8, 2019·0 cites·6 claims
- 4835US2017365536A1Electronic DeviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Nobutake Tsuyuno files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →