Inventor · disambiguated record
Norio Wada
Also filed as: WADA NORIO
13 granted patents·6 pending applications·216 citations·filing 1974–2025
90Inventor score
Files withTOKYO ELECTRON LTD10SHINKO ELECTRIC IND CO4WADA NORIO2BRIDGESTONE TIRE CO LTD1FURUTANI GORO1
Top patents by PatentIndex Score
19 records- 0185US4957697ANuclear fuel rod support grid with generally S-shaped spring structuresWESTINGHOUSE ELECTRIC CORP·Filed 1988·Granted Sep 18, 1990·53 cites·15 claims
- 0281US5365107ASemiconductor device having tab tapeSHINKO ELECTRIC IND CO·Filed 1993·Granted Nov 15, 1994·74 cites·12 claims
- 0370US5384204ATape automated bonding in semiconductor techniqueSHINKO ELECTRIC IND CO·Filed 1993·Granted Jan 24, 1995·47 cites·7 claims
- 0465US9469093B2Bonding apparatus, bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2014·Granted Oct 18, 2016·2 cites·9 claims
- 0565US2023014665A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0659US3976624AMethod for improving adhesion of metallic material with vulcanizable rubber compositionBRIDGESTONE TIRE CO LTD·Filed 1974·Granted Aug 24, 1976·17 cites·4 claims
- 0756US11894246B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 0856US2015072075A1Film-forming apparatus and film-forming methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 0955US2024282617A1Substrate processing apparatus and substrate placing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1054US11482431B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 25, 2022·0 cites·11 claims
- 1153US2025293065A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1251US2013323934A1Dye adsorption device, dye adsorption method and substrate treatment apparatusWADA NORIO·Filed 2011·Application pending·0 cites
- 1347US5183711AAutomatic bonding tape used in semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1991·Granted Feb 2, 1993·16 cites·9 claims
- 1445US2008160260A1Friction material for brakesWADA NORIO·Filed 2007·Application pending·0 cites
- 1544US9165803B2Bonding method, bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2014·Granted Oct 20, 2015·0 cites·13 claims
- 1641US10964563B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2018·Granted Mar 30, 2021·0 cites·10 claims
- 1741US9005385B2Bonding apparatus, bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2014·Granted Apr 14, 2015·0 cites·9 claims
- 1836US5087530AAutomatic bonding tape used in semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1989·Granted Feb 11, 1992·7 cites·10 claims
- 1933US9093222B2Dye adsorption apparatus and dye adsorption methodFURUTANI GORO·Filed 2011·Granted Jul 28, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →